Cutting device

A cutting device comprising:

• a platen;
• a mounting portion configured to mount a cutting blade including a leading end portion disposed at a position separated from an axis by a predetermined distance, the cutting blade being rotatable about the axis, and the axis extending in a third direction intersecting each of a first direction and a second direction intersecting the first direction;
• a movement mechanism including a motor, the motor configured to move a cutting object placed on the platen relative to the mounting portion, in the first direction and the second direction;
• a memory storing computer-readable instructions;
• and
• a processor configured to control the movement mechanism and configured to execute:
• acquiring a hardness-correspondence value corresponding to a hardness of the cutting object placed on the platen;
• acquiring cutting data for cutting a pattern from the cutting object;
• setting an offset amount for a rotation correction to a greater value when the hardness of the cutting object is hard than when the hardness of the cutting object is soft, the rotation correction changing an orientation of the cutting blade at a direction change section at which a direction of cutting the cutting object changes by a predetermined amount or more;
• correcting the data, corresponding to the direction change section of the cutting data with the offset amount;
• and
• cutting the cutting object with the cutting blade mounted to the mounting portion, by controlling the movement mechanism to cause the cutting object placed on the platen to move relative to the mounting portion, in the first direction and the second direction, in accordance with the cutting data.