Combination heat sink

A computing device comprising:

• a motherboard;
• a heat-generating electronic component disposed on the motherboard;
• and
• a heat sink contacting the heat-generating electronic component, the heat sink including:
• a first portion configured to directly contact a heat-generating electronic component of the computing device, the first portion including a first base and a first plurality of fins extending from the first base, the first plurality of fins including a first subset of fins and a second subset of fins, the first base having a first thermal conductivity, the first subset of the first plurality of fins having the first thermal conductivity, the second subset of the first plurality of fins having a second thermal conductivity that is different than the first thermal conductivity;
• and
• a second portion including a second base and a second plurality of fins extending from the second base, the second base being coupled to the first base, the second plurality of fins including a first subset of fins and a second subset of fins, the second base, the first subset of the second plurality of fins, and the second subset of the second plurality of fins each having the second thermal conductivity,
• wherein a fin pitch of the first subset of the first plurality of fins is less than a fin pitch of the second subset of the first plurality of fins, and
• wherein a fin pitch of the first subset of the second plurality of fins is (i) less than a fin pitch of the second subset of the second plurality of fins, and (ii) greater than the fin pitch of the first subset of the first plurality of fins.