Data and power isolation barrier
AssigneeTexas Instruments Incorporated
InventorsDushmantha Bandara Rajapaksha, Roland Sperlich, Anant Shankar Kamath, Vijayalakshmi Devarajan, Wesley Ray
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AssigneeTexas Instruments Incorporated
InventorsDushmantha Bandara Rajapaksha, Roland Sperlich, Anant Shankar Kamath, Vijayalakshmi Devarajan, Wesley Ray
Estimating the term…
A semiconductor package includes a transformer having a primary winding and a secondary winding. The primary winding has first and second terminals and a pair of taps. The secondary winding has first and second terminals and a pair of taps. The semiconductor package includes first and second data transfer circuits, a bridge, and a rectifier. The first data transfer circuit is coupled to the pair of taps of the primary winding. The second data transfer circuit is coupled to the pair of taps of the secondary winding. The bridge is coupled to the first and second terminals of the primary winding. The rectifier is coupled to the first and second terminals of the secondary winding.
An apparatus, comprising:
A circuit, comprising:
A circuit, comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.