Method for soldering electronic component and method for manufacturing LED display

A method for soldering electronic components, comprising:

• providing a circuit substrate;
• providing a plurality of electronic components;
• placing the plurality of electronic components onto the circuit substrate;
• applying a conductor between the plurality of electronic components and the circuit substrate;
• providing an energy source which projects an energy beam with a first coverage;
• enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage, wherein the second coverage is continuous to cover the plurality of electronic components and larger than the first coverage;
• and
• melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor.