Surface acoustic wave resonator with multi-layer piezoelectric substrate with heat dissipation
AssigneeSkyworks Solutions, Inc.
InventorsKeiichi Maki, Rei Goto, Gong Bin Tang, Yosuke Hamaoka
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Abstract
Aspects of this disclosure relate to a surface acoustic wave resonator having a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate, a piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. Related surface acoustic wave filters, radio frequency modules, and wireless communication devices are also disclosed.
Claims20
A radio frequency module comprising:
- a radio frequency switch configured to pass a radio frequency signal;
- a surface acoustic wave filter configured to filter the radio frequency signal, the surface acoustic wave filter including a surface acoustic wave resonator configured to generate a surface acoustic wave having a wavelength of λ, the surface acoustic wave resonator including a support substrate, a piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator, the thermally conductive layer being disposed between the support substrate and the piezoelectric layer, and the thermally conductive layer having a thickness in a range between 10 nanometers and 0.03λ;
- and
- a package enclosing the surface acoustic wave filter and the radio frequency switch.
A surface acoustic wave resonator comprising:
- a support substrate;
- a piezoelectric layer;
- and
- a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator, the thermally conductive layer being disposed between the support substrate and the piezoelectric layer, the surface acoustic wave resonator configured to generate a surface acoustic wave having a wavelength of λ, and the thermally conductive layer having a thickness in a range between 10 nanometers and 0.03λ.
A wireless communication device comprising:
- a surface acoustic wave filter configured to provide a filtered radio frequency signal, the surface acoustic wave filter including a surface acoustic wave resonator configured to generate a surface acoustic wave having a wavelength of λ, the surface acoustic wave resonator including a support substrate, a piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator, the thermally conductive layer being disposed between the support substrate and the piezoelectric layer, the thermally conductive layer having a thickness in a range between 10 nanometers and 0.03λ;
- and
- an antenna configured to transmit the filtered radio frequency signal.
Dependencies are inferred from the claim text.