Method for preparing low melting point metal particles, conductive paste and method for preparing the same

A method for preparing a conductive paste, comprising:

• S21, providing an organic resin carrier having fluidity;
• S22, adding a low melting point metal material and the organic resin carrier into a sealed container which is vacuumized or filled with a protective gas;
• S23, making a temperature in the sealed container higher than a melting point of the low melting point metal and performing dispersion by stirring;
• S24, lowering the temperature, after performing the dispersion, to be below the melting point of the low melting point metal with continuous stirring during a cooling process to obtain low melting point metal particles dispersed in the organic resin carrier;
• and
• S25, mixing a conductive filler with the material obtained in S24 uniformly to obtain the conductive paste.

A method for preparing a conductive paste, comprising:

• S31, providing an organic resin carrier having fluidity;
• S32, adding a low melting point metal material and the organic resin carrier into a sealed container which is vacuumized or filled with a protective gas;
• S33, making a temperature in the sealed container higher than a melting point of the low melting point metal and performing dispersion by stirring;
• S34, lowering the temperature, after performing the dispersion, to be below the melting point of the low melting point metal with continuous stirring during a cooling process to obtain low melting point metal particles dispersed in the organic resin carrier;
• S35, dissolving, washing and drying the organic resin in the organic resin carrier to separate low melting point metal particles;
• S36, dissolving a third organic resin with a third solvent to obtain a third organic resin solution;
• S37, adding a conductive filler and the low melting point metal particles to the third organic resin solution obtained in S36, and mixing the mixture uniformly to obtain the conductive paste.