Sensor system with a microelectromechanical sensor element and method for producing a sensor system
AssigneeInfineon Technologies Dresden GmbH
InventorsDirk Meinhold, Steffen Bieselt, Claudia Hengst, Daniel Koehler, Erhard Landgraf, Sebastian Pregl
Life of this patent
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Abstract
A sensor system with a first semiconductor die part and with a second semiconductor die part is proposed, wherein the first semiconductor die part has a microelectromechanical sensor element, wherein the second semiconductor die part covers the microelectromechanical sensor element, wherein the second semiconductor die part has a via for electrically contacting the microelectromechanical sensor element, in particular directly. A method for producing a sensor system is also proposed.
Claims20
A sensor system comprising:
- a first semiconductor die part, and
- a second semiconductor die part,
- wherein the first semiconductor die part includes a microelectromechanical sensor element,
- wherein the second semiconductor die part covers the microelectromechanical sensor element,
- wherein the second semiconductor die part includes a via for electrically contacting the microelectromechanical sensor element, and
- wherein the via extends through the second semiconductor die part and through a contact surface provided between the first semiconductor die part and the second semiconductor die part.
A sensor system, comprising:
- a microelectromechanical sensor element included in a first semiconductor die part;
- and
- a semiconductor device included in a second semiconductor die part,
- wherein the second semiconductor die part covers the microelectromechanical sensor element,
- wherein a via extends through the second semiconductor die part and through a contact surface provided between the first semiconductor die part and the second semiconductor die part, and
- wherein the via connects the semiconductor device to the microelectromechanical sensor element in an electrically conductive manner.
A sensor system, comprising:
- a microelectromechanical sensor element included in a first semiconductor die part;
- and
- an integrated sensor element included in a second semiconductor die part,
- wherein the second semiconductor die part covers the microelectromechanical sensor element, and
- wherein a via extends through the second semiconductor die part and through a contact surface provided between the first semiconductor die part and the second semiconductor die part.
Dependencies are inferred from the claim text.