Back to results
US 12,042,965 B2Granted
Injection molding system
AssigneeSeiko Epson Corporation
InventorsHidenobu Maruyama, Kenta Anegawa
Life of this patent
Estimating the term…
Abstract
An injection molding system includes a main unit in which a first injection molding machine that injects a first molding material and molds a molded article is disposed and a control unit separated from the main unit and configured to control the first injection molding machine. The control unit is coupled to the main unit via a connection cable having predetermined length.
Claims8
An injection molding system comprising:
- a main unit in which a first injection molding machine that injects a first molding material and molds a molded article is disposed;
- and
- a control unit separated from the main unit, the control unit including a programmable logic controller, the programmable logic controller being configured to control the first injection molding machine, wherein
- the control unit is coupled to the main unit via a connection cable having a predetermined length,
- each of the main unit and the control unit each has wheels, and the main unit and the control unit are configured to be moved independently via the wheels,
- the main unit includes a box-like cover that covers the first injection molding machine,
- the box-like cover includes:
- a first door provided on a first side surface of the box-like cover, and the first door is configured to be openable and closable;
- and
- a second door provided on a second side surface of the box-like cover, and the second door is configured to be openable and closable,
- the first side surface and the second side surface of the box-like cover are different surfaces from a ceiling surface of the box-like cover, and
- a lower end of the first door and a lower end of the second door are provided at positions higher than an upper end of the control unit.
9 more elements
Dependencies are inferred from the claim text.