Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module

A camera module, characterized by comprising:

• at least one optical lens;
• at least one photosensitive chip, wherein the at least one optical lens is provided on a photosensitive path of the at least one photosensitive chip;
• at least one circuit board, comprising a substrate having a front face and a back face, and wherein the at least one photosensitive chip is electrically connected to the circuit board at the front surface;
• and
• a molding unit, comprising a back molding portion and a molding base, wherein the molding base is integrally bonded to the front face of the substrate at the same time when the back molding portion is integrally bonded to at least a part of an area of the back face of the substrate, and the back molding portion have a mounting space corresponding to the photosensitive chip;
• wherein the camera module has at least one dividing side and at least one die releasing side, and the back molding portion has at least a first dividing face and at least a first die releasing face, and the first dividing face of the back molding portion corresponds to the dividing side of the camera module, and the first die releasing face of the back molding portion corresponds to the die releasing side of the camera module, and the molding base has at least a second dividing face and at least a second die releasing face, and the second dividing face of the molding base corresponds to the dividing side of the camera module, and the second die releasing face of the molding base corresponds to the die releasing side of the camera module, and the substrate has at least a dividing edge and at least a die releasing edge, and the dividing edge of the substrate corresponds to the dividing side of the camera module, and the die releasing edge of the substrate corresponds to the die releasing side of the camera module.