Solution-based deposition method for preparing semiconducting thin films via dispersed particle self-assembly at a liquid-liquid interface

A device for coating semiconductor/semiconductor precursor particles on a flexible substrate, wherein the device comprises:

• a container configured to contain a first solvent and a second solvent substantially immiscible with each other;
• injection means configured to inject a predetermined volume of a dispersion of at least one layered semiconductor material or its precursor(s) in the form of particles from underneath and up to a liquid-liquid interface formed within the container and between the first solvent and the second solvent, and creating a film of particles at the liquid-liquid interface;
• a first support means configured to be able to be at least partially submerged in the first solvent, wherein the first support means is configured to support at least a portion of a substrate;
• substrate extracting means configured to exert a force on the substrate causing the substrate to be drawn away from the liquid-liquid interface;
• substrate supply means configured to provide a supply of the substrate;
• compression means, configured to reduce a distance between particles of the at least one layered semiconductor material or its precursor(s) of the film at the liquid-liquid interface and push the film onto the substrate, wherein the compression means comprises a plurality of means for pushing mounted on a drive device, the plurality of means for pushing configured such that at least two of the plurality of means for pushing may be at least partially submerged in the second solvent during rotation of the drive device, and moved through the second solvent toward the first support means.