Resin composition for generating allylphenol-maleimide copolymer for electronic component protective film, and electronic component protective film comprising this copolymer

A resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component comprising:

• (A) an allyl group-containing phenol compound having a rigid structure;
• (B) an N-aromatic maleimide group-containing compound having a rigid structure;
• and
• (C) an N-aliphatic maleimide group-containing compound having a flexible structure;
• wherein Compound (A) is represented by Formula 1 below, Compound (B) is represented by Formula 2 below, and Compound (C) is represented by Formula 3 below;
• wherein an equivalence ratio of the allyl group-containing phenol compound having the rigid structure (A) to a total of the N-aromatic maleimide group-containing compound having the rigid structure (B) and the N-aliphatic maleimide group-containing compound having the flexible structure (C) is from 1:1 to 1:3;
• and
• wherein an equivalence ratio of the N-aromatic maleimide group-containing compound having the rigid structure (B) to the N-aliphatic maleimide group-containing compound having the flexible structure (C) is from 1:0.6 to 1:1.6,
• wherein n is 1 or 2;
• wherein n is 0 to 2;