Thermal print head, thermal printer and methods fabricating thereof
AssigneeRohm Co., Ltd.
InventorsGoro Nakatani, Nobukazu Kise
Life of this patent
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Abstract
The present disclosure provides a thermal print head. The thermal print head includes a substrate, having a main surface facing one side in a thickness direction; a resistor layer, including a plurality of heat generating portions arranged in a main scanning direction and supported by the substrate; and a wiring layer, forming a power path to the plurality of heat generating portions and supported by the substrate. The substrate includes a convex portion protruding from the main surface and extending along the main scanning direction. The convex portion includes: a flat first surface on which each of the plurality of heat generating portions is disposed; and a first curved convex surface connected to the first surface.
Claims20
A thermal print head, comprising:
- a substrate, having a main surface facing one side in a thickness direction;
- a resistor layer, including a plurality of heat generating portions arranged in a main scanning direction and supported by the substrate;
- and
- a wiring layer, forming a power path to the plurality of heat generating portions and supported by the substrate, wherein
- the substrate includes a convex portion protruding from the main surface and extending along the main scanning direction,
- the convex portion includes:
- a flat first surface on which each of the plurality of heat generating portions is disposed;
- and
- a first curved convex surface connected to the first surface,
- wherein the wiring layer comprises a first conductive layer and a second conductive layer, the plurality of heat generating portions are exposed from the first conductive layer, and a part of the first conductive layer is exposed from the second conductive layer,
- wherein the convex portion further includes a top surface parallel to the main surface, and
- wherein a portion of the top surface of the convex portion is covered by both the first conductive layer and the second conductive layer.
A method of fabricating a thermal print head, comprising:
- providing a substrate made of a monocrystalline semiconductor;
- processing the substrate to have a main surface facing one side in a thickness direction and have a convex portion protruding from the main surface and extending in a main scanning direction;
- forming a resistor layer supported by the substrate and including a plurality of heat generating portions arranged in the main scanning direction;
- and
- forming a wiring layer which is supported by the substrate and forms a power path to the plurality of heat generating portions, wherein
- the convex portion includes:
- a flat first surface on which each of the plurality of heat generating portions is disposed;
- and
- a first curved convex surface connected to the first surface, and wherein
- the processing of the substrate includes:
- forming an intermediate convex body having the first surface and protruding from the main surface;
- and
- forming a first curved convex surface on the intermediate convex body,
- wherein the wiring layer comprises a first conductive layer and a second conductive layer, the plurality of heat generating portions are exposed from the first conductive layer, and a part of the first conductive layer is exposed from the second conductive layer,
- wherein the convex portion further includes a top surface parallel to the main surface, and
- wherein a portion of the top surface of the convex portion is covered by both the first conductive layer and the second conductive layer.
Dependencies are inferred from the claim text.