Dividing device for wafer
AssigneeNakamura-Tome Precision Industry Co., Ltd.
InventorsTsuyoshi Naya, Masakazu Takazawa
Life of this patent
Estimating the term…
Abstract
A dividing device divides a wafer from an ingot by slicing the ingot by using a dividing layer which is formed by relatively moving a laser beam to a predetermined depth of the ingot from one of both end faces of the ingot. The dividing device for a wafer includes: first fixing part that fixes the other of the both end faces of the ingot; second fixing part that is arranged on a first central axis line of the ingot so as to face the first fixing part and fixes the one of the both end faces of the ingot; and tension part that apply a tensile force to the ingot via the first and second fixing parts. The tension part rotates one end of the dividing layer with another end as a fulcrum so as to generate moments for slicing the ingot with the dividing layer as a boundary.
Claims8
A dividing device for a wafer, the dividing device dividing the wafer from an ingot by slicing the ingot with a division layer as a boundary, the division layer being formed by relatively moving a laser beam along one of both end faces of the ingot, the laser beam being condensed to a predetermined depth of the ingot from the one of the both ends of the ingot;
- the dividing device comprising:
- a first fixing part that is configured to fix the other of the end faces of the ingot;
- a second fixing part that is arranged on a first central axis line of the ingot so as to face the first fixing part and is configured to fix the one of the end faces of the ingot;
- and
- a tension part that is configured to apply a tensile force to the ingot via the first fixing part and the second fixing part, wherein
- the tension part is configured to rotate a first end of the division layer with a second end of the division layer as a fulcrum so as to generate a moment for slicing the ingot with the division layer as the boundary;
- the tension part includes:
- a holding part that holds the first fixing part;
- and
- a moving part that is configured to move the second fixing part in a direction away from the holding part to apply a tensile force to the ingot;
- the holding part includes a second central axis that is coaxial with or parallel to the first central axis, and the moving part includes a third central axis that is coaxial with or parallel to the first central axis and the moving part is configured to be moved by a driving force acting along the third central axis;
- the holding part further includes:
- a shaft that extends along the second central axis, and has a first end part and a second end part;
- a coupling part that couples the first end part of the shaft and the first fixing part;
- and
- a supporting part that pivotally and rotatably supports the second end part of the shaft so as to allow the shaft to be rotatable within a predetermined range;
- and
- the second central axis is offset from the first central axis.
Dependencies are inferred from the claim text.