Cable bonding protection for head dimensional stability
AssigneeInternational Business Machines Corporation
InventorsJason Liang, Hoodin Hamidi, Daniel Brown
Life of this patent
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Abstract
An apparatus includes a beam, a chip coupled to the beam, a cable coupled to the beam by a first material located at opposite edges of the cable, and wire bonds extending from pads of the cable to pads of the chip. An apparatus includes a beam and a chip coupled to the beam. The chip includes an array of magnetic transducers for transducing data on a magnetic recording tape. The apparatus includes a cable coupled to the beam by a first material located at opposite edges of the cable, wire bonds extending from pads of the cable to pads of the chip, and a second material encapsulating ends of the wire bonds that are located adjacent the cable. The second material does not contact the chip.
Claims20
An apparatus, comprising:
- a beam;
- a chip coupled to the beam, wherein the chip includes at least one magnetic transducer;
- a cable coupled to the beam by a first material located at opposite edges of the cable;
- and
- wire bonds extending from pads of the cable to pads of the chip.
An apparatus, comprising:
- a beam;
- a chip coupled to the beam;
- a cable coupled to the beam by a first material located at opposite edges of the cable;
- and
- wire bonds extending from pads of the cable to pads of the chip;
- a second material encapsulating ends of the wire bonds that are located adjacent the cable,
- wherein the second material extends for a distance above the cable in a direction perpendicular to the cable that is greater than a distance the wire bonds extend above the cable in the same direction.
An apparatus, comprising:
- a beam;
- a chip coupled to the beam, wherein the chip includes an array of magnetic transducers for transducing data on a magnetic recording tape;
- a cable coupled to the beam by a first material located at opposite edges of the cable;
- wire bonds extending from pads of the cable to pads of the chip;
- and
- a second material encapsulating ends of the wire bonds that are located adjacent the cable,
- wherein the second material does not contact the chip.
Dependencies are inferred from the claim text.