US 12,033,674 B2 · Reduction of high tape contact pressure points against head assembly

Abstract

The present disclosure generally relates to a head assembly in a data storage device. The data storage device may include magnetic media embedded in the device or magnetic media from an insertable cassette or cartridge (e.g., in an LTO drive), where the head assembly reads from and writes to the magnetic media. During device operation, the magnetic media moves across the head assembly. The magnetic media experiences higher contact stress at certain points or portions of the head assembly. A sensor guard is coupled to the head assembly. The sensor guard comprises at least one chamfered surface or at least one stepped surface to decrease the contact stress between the magnetic media and the head assembly during device operation. The at least one chamfered or stepped surface may be disposed on a leading edge of the sensor guard.

Claims11

Dependent claims

A magnetic recording head assembly, configured to read from and write to a magnetic media, comprising:

one or more rows of chiplets, each of the one or more rows of chiplets having a leading edge, a trailing edge, a first side edge, and a second side edge, the first and second side edges being disposed between the leading edge and the trailing edge;
and
one or more sensor guards disposed adjacent to at least one of the first side edge and the second side edge of each of the one or more of rows of chiplets, wherein each of the one or more sensor guards comprises:
a first surface disposed at a first media facing surface (MFS);
a second surface disposed perpendicular to the first surface;
and
a chamfered surface coupling the first surface to the second surface, wherein the chamfered surface of each of the one or more sensor guards has a first ratio of depth to width between about 0.01 and about 0.2 so as to enable contact of the magnetic media during read and write operations.

4 more elements

Dependencies are inferred from the claim text.

Reduction of high tape contact pressure points against head assembly

Life of this patent

Reduction of high tape contact pressure points against head assembly

Life of this patent

Abstract

Claims11