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US 12,031,066 B2Granted
Insulated wire and preparation method thereof, coil and electronic/electrical device
AssigneeWell Ascent Electronic (Ganzhou) Co., Ltd.
InventorsHuimin Ye, Zuomao Zhu
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Abstract
Example implementations include an insulated wire and a preparation method thereof, a coil and an electronic/electrical device. A bonding layer containing PEEK nano-powder is arranged between a conductor and a PEEK resin insulating layer, and a bonding agent for forming the bonding layer contains organic solvent, polyamide-imide resin and PEEK nano-powder material which are mixed.
Claims20
An insulated wire, comprising a conductor, and a bonding layer and a PEEK resin insulating layer arranged outside the conductor in turn,
- the bonding layer is located between the conductor and the PEEK resin insulating layer;
- the PEEK resin insulating layer is made of a PEEK resin material;
- and
- the bonding layer is formed by curing a bonding agent, which comprises organic solvent, polyamide-imide resin and PEEK nano-powder material which are mixed;
- the bonding agent comprises, based on parts by weight, 50-80 parts of organic solvent, 20-30 parts of polyamide-imide resin and 2-8 parts of PEEK nano-powder material;
- a viscosity at 30° C. of 3,000 cp.
3 more elements
A method for preparing an insulated wire, comprising:
- step 1, applying a bonding agent to a surface of a conductor to form a bonding layer covering the conductor and obtain a core wire;
- and
- step 2, extruding a PEEK resin material outside the bonding layer of the core wire to form a PEEK resin insulating layer and obtain an insulated wire;
- in step 1, the bonding agent is prepared by the following steps:
- dissolving polyamide-imide resin in the organic solvent, and heating and stirring the solution;
- and
- adding the PEEK nano-powder material and dissolving the solution under stirring to obtain the bonding agent;
- the bonding agent comprises, based on parts by weight, 50-80 parts of organic solvent, 20-30 parts of polyamide-imide resin and 2-8 parts of PEEK nano-powder material;
- a viscosity at 30° C. of 3,000 cp;
- after the step of adding the PEEK nano-powder material and dissolving the solution under stirring, further comprising:
- adding the organic solvent, and preferably, a mixture of N-methylpyrrolidone and xylene to adjust the solid content and viscosity:
- adding the dispersant, wherein
- the dispersant is selected from one or more of cetyltrimethylammonium bromide, an alkylphenol ethylene oxide condensate emulsifier, sodium dodecyl sulfate, sodium dodecyl sulfonate and sodium dodecylbenzene sulfonate.
10 more elements
Dependencies are inferred from the claim text.