Thermoelectric conversion module, insulated circuit substrate, method for bonding members, and method for attaching a thermoelectric conversion module

An insulated circuit substrate comprising:

• a thermoelectric conversion element pair in which an n-type thermoelectric conversion element and a p-type thermoelectric conversion element are connected by interposing an electrode plate;
• and
• a thermal conductive insulating layer,
• wherein a plurality of thermoelectric conversion element pairs is arranged on one surface of the thermal conductive insulating layer and electrically connected in series,
• a first output terminal is provided on the thermoelectric conversion element pair arranged at one end side of the plurality of the thermoelectric conversion element pairs electrically connected in series, and a second output terminal is provided on the thermoelectric conversion element pair arranged at an other end side of the plurality of the thermoelectric conversion element pairs electrically connected in series,
• an intermediate output terminal is provided at any position between the thermoelectric conversion element pair arranged at the one end side and the thermoelectric conversion element pair arranged at the other end side, and
• thermoelectric conversion element pair rows, which are formed by linearly arranging the plurality of the thermoelectric conversion element pairs along a first direction of the one surface, are aligned in a plurality of rows along a second direction of the one surface and connected in a crank shape to form the intermediate output terminal used as the electrode plate at a connecting portion between the thermoelectric conversion element pair rows adjacent to each other.