Back to results
US 12,027,975 B2Granted
Packaged module with sintered switch
AssigneeMarel Power Solutions, Inc.
InventorJean-Claude Harel
Life of this patent
Estimating the term…
Abstract
A packaged power module includes a case, and a metal structure that has first and second surfaces. A transistor is also included that has first and second terminals between which current is transmitted when the transistor is activated, and a control terminal controlling the transistor, wherein the first terminal is sintered to the first surface. A first opening through the case exposes the second surface.
Claims17
An apparatus comprising:
- a first device comprising:
- a first case;
- a first metal structure comprising first and second surfaces between which current can be transmitted;
- a first transistor comprising first and second terminals between which current is transmitted when the first transistor is activated, and a first control terminal for controlling the first transistor, wherein the first terminal is sintered to the first surface via a conductive layer that comprises a sintering material;
- a first opening through the first case that exposes the second surface;
- a second metal structure comprising first and second surfaces between which current can be transmitted;
- a second transistor comprising first and second terminals between which current is transmitted when the second transistor is activated, and a second control terminal for controlling the second transistor, wherein the first terminal of the second transistor is sintered to the first surface of the second metal structure;
- a second opening through the first case for exposing the second surface of the second metal structure;
- a first metal element comprising first and second surfaces between which current can be transmitted, wherein the second terminal of the first transistor is sintered to the first surface of the first metal element;
- a second metal element comprising first and second surfaces between which current can be transmitted, wherein the second terminal of the second transistor is sintered to the first surface of the second metal element;
- a third opening through the first case for exposing the second surface of the first metal element;
- a fourth opening through the first case for exposing the second surface of the second metal element.
9 more elements
An apparatus comprising:
- a first device comprising:
- a first metal structure comprising first and second oppositely facing surfaces;
- a first metal element comprising a first surface;
- a first switch positioned between the first metal structure and the first metal element;
- wherein the first switch is sintered to the first surfaces of the first metal structure and the first metal element, wherein the first switch is configured to transmit 1 amp of current or more between the first metal structure and the first metal element when the first switch is activated;
- wherein the first and second oppositely facing surfaces are electrically and thermally connected together;
- wherein the second surface of the first metal structure is configured for electrical and thermal connection to a surface of a heat sink.
4 more elements
A method comprising:
- sintering a first current terminal of a first switch to a first surface of a first metal structure, wherein the first metal structure comprises the first and a second surface, wherein the first and second surfaces are oppositely facing;
- after sintering the first current terminal to the first surface of the first metal structure, sintering a second current terminal of the first switch to a first surface of a first metal element;
- wherein the first and second oppositely facing surfaces are electrically and thermally connected to each other;
- wherein the second surface of the first metal structure is configured for electrical and thermal connection to a surface of a heat sink.
1 more element
Dependencies are inferred from the claim text.