Process for producing adjacent chips comprising LED wires and device obtained by the process

A process for producing two adjacent chips each comprising an array of light-emitting wires connected together in a given chip by a transparent conductive layer, comprising the following steps:

• producing, on a substrate, a plurality of individual zones for growing wires extending over an area greater than the cumulative area of said two adjacent chips;
• growing wires (NTi) in the individual growth zones through apertures in a mask located on a surface of the substrate;
• removing the wires from at least one individual growth zone forming an initial free area so as to define said arrays of light-emitting wires, said initial free area comprising imprints that are individual growth zones level with the removed wires;
• and then
• depositing the transparent conductive layer on each array of light-emitting wires so as to electrically connect together the light-emitting wires in the given chip, each transparent conductive layer being separated from the transparent conductive layer of the neighbouring chip by a free area,
• wherein the transparent conductive layer is also deposited so as to partially cover the at least one individual growth zone from which the wires have been removed, and
• wherein the individual growth zones are the apertures (zcia, zci) defined in the mask located on the surface of said substrate.