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US 12,027,489 B2Granted
Systems and methods for fabricating silicon die stacks for electron emitter array chips
OwnerUkyo Jeong, Ghiyuun Kanginventors
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Abstract
A method for fabricating silicon die stacks for electron emitter chips by applying sintering to bind a silicon substrate die to other die layers. Metal powder is applied to the bonding surface of the die, covered with the chip carrier or chip and compressed between two heated plates. The bonding pads of the die may be conductively coupled to corresponding bonding pads of the other die layers.
Claims20
A method for fabricating a field emitter array comprising:
- obtaining a silicon substrate die having a bonding surface;
- obtaining a chip carrier having an electric circuit and wire bonding surfaces;
- obtaining a metal powder;
- applying the metal powder to the bonding surface of the die;
- covering the metal powder with the chip carrier;
- compressing the die and carrier between two heated plates;
- and
- conductively coupling bonding pads of the die to corresponding bonding pads of the chip carrier.
5 more elements
A method for fabricating a field emitter array comprising:
- obtaining an integrated circuit chip having a gold coated silicon base;
- obtaining a chip carrier having a gold coated upper side;
- obtaining a metal powder;
- applying the metal powder to the gold coated upper side of the chip carrier;
- covering the metal powder with the integrated circuit chip;
- compressing the integrated circuit chip and carrier between two heated plates.
3 more elements
A method for fabricating a field emitter array comprising:
- obtaining an integrated circuit chip having a gold coated silicon base;
- obtaining a chip carrier having a gold coated upper side, an electric circuit and wire bonding surfaces;
- obtaining a metal powder;
- applying a first layer of the metal powder to the gold coated upper side of the chip carrier;
- covering the first layer of the metal powder with the integrated circuit chip;
- compressing the integrated circuit chip and carrier between two heated plates thereby obtaining a bonded chip and chip carrier;
- obtaining a silicon substrate die having a bonding surface;
- applying a second layer of the metal powder to the bonding surface of the die;
- covering the second layer the metal powder with the chip carrier;
- compressing the die and the bonded chip and chip carrier between two heated plates;
- and
- conductively coupling bonding pads of the die to corresponding bonding pads of the chip carrier.
9 more elements
Dependencies are inferred from the claim text.