Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method
AssigneeMitsubishi Materials Corporation
InventorNobuyuki Terasaki
Life of this patent
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Abstract
A bonded body of copper and ceramic includes: a copper member made of copper or a copper alloy and a ceramic member made of an aluminum oxide, the copper member and the ceramic member being bonded to each other; a magnesium oxide layer which is formed on a ceramic member side between the copper member and the ceramic member; and a Mg solid solution layer which is formed between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase, in which one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer.
Claims8
A bonded body of copper and ceramic comprising:
- a copper member made of copper or a copper alloy and a ceramic member made of an aluminum oxide, the copper member and the ceramic member being bonded to each other;
- a magnesium oxide layer which is formed on a ceramic member side between the copper member and the ceramic member;
- and
- a Mg solid solution layer which is formed between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase,
- wherein one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer;
- and
- wherein a thickness of the magnesium oxide layer is in a range of 50 nm or more and 1000 nm or less.
An insulating circuit substrate comprising:
- a copper sheet made of copper or a copper alloy and a ceramic substrate made of an aluminum oxide, the copper sheet being bonded to a surface of the ceramic substrate;
- a magnesium oxide layer which is formed between the copper sheet and the ceramic substrate on a ceramic substrate side;
- and
- a Mg solid solution layer which is formed between the magnesium oxide layer and the copper sheet and contains Mg in a state of a solid solution in a Cu primary phase,
- wherein one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer;
- and
- wherein a thickness of the magnesium oxide layer is in a range of 50 nm or more and 1000 nm or less.
Dependencies are inferred from the claim text.