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US 12,027,343 B2Granted
Real-time direct measurement of mechanical properties in-situ of scanning beam microscope
AssigneeUniversity of Connecticut
InventorsJoseph Favata, SIna Shahbazmohamadi, Valery Ray, Ali Hadjikhani
Life of this patent
Estimating the term…
Abstract
System and methods are described for directly measuring mechanical properties of a sample while concurrently imaging the sample using a scanning beam microscope (e.g., a scanning electron microscope (SEM)).
Claims18
A method for measurement of mechanical properties of a sample during electronic imaging with a microscope, the method comprising:
- positioning a load cell into physical contact with the sample, where the load cell is configured to measure a magnitude of force applied to the sample;
- capturing electronic image data of the sample;
- and
- operating a micro-manipulator to apply a force to the sample while capturing the electronic image data.
1 more element
A system for measurement of mechanical properties of a sample during imaging, the system comprising:
- a load cell configured to contact the sample and measure a magnitude of force applied to the sample during a test;
- a micro-manipulator configured to apply force to the sample during the test;
- an imaging system configured to capture image data of the sample during the test;
- and
- an electronic controller configured to
- receive the image data, wherein the image data includes at least one image of the sample while the force is applied to the sample by the micro-manipulator, and
- correlate data indicative of the magnitude of force applied to the sample with the image data.
4 more elements
A system for testing a semiconductor device, the system comprising:
- a stage for hosting the semiconductor device during a test;
- a micro-manipulator configured to apply force to the semiconductor device;
- a load cell for measuring a magnitude of the force when applied;
- and
- an imaging system configured for capturing image data of the semiconductor device when the force is applied;
- and
- an electronic controller configured to
- receive the image data, wherein the image data includes at least one image of the semiconductor device while the force is applied, and
- correlate data indicative of the magnitude of the force with the image data.
6 more elements
Dependencies are inferred from the claim text.