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US 12,026,330 B2Granted
Conductive laminate, touch panel, and manufacturing method for conductive laminate
AssigneeFUJIFILM Corporation
InventorDaisuke Inoue
Life of this patent
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Abstract
A conductive laminate includes a first organic film, a fine metal wire arranged on the first organic film, and a second organic film arranged to cover the fine metal wire, in which the fine metal wire includes a blackening layer, an intimate attachment layer, and a metal conductive layer in order from a side of the first organic film, and moisture contents of the first organic film and the second organic film are less than 3.00%.
Claims17
A conductive laminate comprising:
- a first organic film;
- a fine metal wire arranged on the first organic film;
- and
- a second organic film arranged to cover the fine metal wire,
- wherein the fine metal wire includes a blackening layer, an intimate attachment layer, and a metal conductive layer in order from a side of the first organic film,
- wherein moisture contents of the first organic film and the second organic film are less than 3.00%, and
- wherein the blackening layer contains at least one metal atom selected from the group consisting of Mo, Nb, Cr, W, Ni, Ta, V, Co, Cu, Sn, and Mn.
4 more elements
A manufacturing method for a conductive laminate, comprising:
- a step of forming a first organic film;
- a step of forming a fine metal wire on the first organic film;
- and
- a step of forming a second organic film to cover the fine metal wire,
- wherein the fine metal wire includes a blackening layer, an intimate attachment layer, and a metal conductive layer in order from a side of first organic film,
- wherein moisture contents of the first organic film and the second organic film are less than 3.00%, and
- wherein the blackening layer contains at least one metal atom selected from the group consisting of Mo, Nb, Cr, W, Ni, Ta, V, Co, Cu, Sn, and Mn.
4 more elements
Dependencies are inferred from the claim text.