Silver patterning and interconnect processes
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYou-Hua Chou, Kuosheng Chuang
Life of this patent
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Abstract
A method for forming a semiconductor structure is provided. The method includes depositing a hard mask layer over a substrate. The method further includes depositing a silver precursor layer over the hard mask layer. The method further includes exposing portions of the silver precursor layer to a radiation, the radiation causing a reduction of silver ions in the irradiated portions of the silver precursor layer. The method further includes removing non-irradiated portions of the silver precursor layer, resulting in a plurality of silver seed structures.
Claims11
A method for forming a semiconductor structure, comprising:
- forming an interlayer dielectric (ILD) layer over a substrate;
- depositing a silver precursor layer over the ILD layer;
- irradiating portions of the silver precursor layer to reduce silver ions, thereby forming a plurality of silver seed structures;
- removing non-irradiated portions of the silver precursor layer;
- depositing silver over the plurality of silver seed structures to form a plurality of patterned silver structures, the plurality of patterned silver structures having a dimension greater than the plurality of silver seed structures;
- etching the ILD layer using the plurality of patterned silver structures as an etch mask to form a plurality of contact openings in the ILD layer;
- and
- forming a plurality of contact structures in the plurality of contact openings.
A method for forming a semiconductor structure, comprising:
- depositing an interlayer dielectric (ILD) layer over a substrate;
- forming a hard mask layer over the ILD layer;
- depositing a silver precursor layer over the hard mask layer;
- exposing portions of the silver precursor layer to a radiation, the radiation causing reduction of silver ions in the irradiated portions of the silver precursor layer;
- removing non-irradiated portions of the silver precursor layer, resulting in a plurality of silver seed structures;
- depositing silver over the plurality of silver seed structures to provide a plurality of patterned silver structures;
- forming at least one contact opening within the hard mask layer and the ILD layer using the plurality of patterned silver structures as an etch mask;
- depositing a contact liner layer along sidewall and bottom surfaces of the at least one contact opening and over the plurality of patterned silver structures;
- and
- depositing a contact material layer over the contact liner layer to fill the at least one contact opening, wherein the contact liner layer and the contact material layer comprise silver.
Dependencies are inferred from the claim text.