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US 12,025,656 B2Granted
Semiconductor module including semiconductor package and semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsSeyoung Won, Dan-Kyu Kang, Sang-Yeol Lee
Life of this patent
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Abstract
A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.
Claims8
A semiconductor module comprising:
- a plurality of semiconductor packages provided on a substrate;
- and
- an environment information indicator provided on the substrate and configured to collect and display information related to surroundings of the plurality of semiconductor packages,
- wherein the environment information indicator includes a temperature indicator including a plurality of indicators,
- wherein the plurality of indicators have different critical values,
- wherein the temperature indicator is configured to indicate a highest temperature affecting the semiconductor module after the temperature indicator being provided on the substrate by irreversibly changing respective color of each the plurality of indicators having the different critical values when an ambient temperature exceed respective critical values of each of the plurality of indicators, and
- wherein the environment information indicator further includes an X-ray indicator that comprises:
- an X-ray film;
- and
- a first cap attached to a first surface of the X-ray film, the first cap exposing a portion of the first surface of the X-ray film through a first pattern.
7 more elements
A semiconductor module comprising:
- a plurality of semiconductor packages provided on a substrate;
- and
- an environment information indicator provided on the substrate and configured to collect and display information related to surroundings of the plurality of semiconductor packages,
- wherein the environment information indicator includes an electrical overstress (EOS) indicator,
- wherein the EOS indicator comprises:
- a plurality of fuses having different critical values of currents to be disconnected;
- and
- a plurality of temperature indicators coupled to the plurality of fuses respectively,
- wherein the EOS indicator is configured to visibly indicate a highest EOS affecting the semiconductor module after the EOS indicator being provided on the substrate by irreversibly changing respective color of each the plurality of temperature indicators based on a heat generated when each of the plurality of fuses having the different critical values of currents to be disconnected is disconnected,
- wherein the environment information indicator further includes an X-ray indicator, and
- wherein the X-ray indicator comprises:
- an X-ray film;
- and
- a first cap attached to a first surface of the X-ray film, the first cap exposing a portion of the first surface of the X-ray film through a first pattern.
11 more elements
Dependencies are inferred from the claim text.