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US 12,024,660 B2Granted
Conductive particle and manufacturing method thereof, adhesive and application thereof
AssigneeHkc Corporation Limited
InventorsYuming Xia, Chongwei Tang
Life of this patent
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Abstract
The disclosure relates to a conductive particle and a manufacturing method thereof, an adhesive and an application thereof. The conductive particle includes a core, a conductive carbon layer and a conductive polymer layer. The conductive carbon layer covers the core, and the conductive polymer layer is provided on the conductive carbon layer. The conductivity of the conductive particle is higher.
Claims19
A conductive particle, comprising:
- a core;
- a conductive carbon layer covering the core;
- and
- a conductive polymer layer provided on the conductive carbon layer, wherein the conductive polymer layer is spaced apart from the core, a material of the conductive carbon layer has a carboxyl group, and the carboxyl group forms a chemical bond with a material of the conductive polymer layer.
1 more element
A conductive particle, comprising:
- a core;
- a conductive carbon layer covering the core;
- and
- a conductive polymer layer provided on the conductive carbon layer, wherein a material of the conductive carbon layer has a carboxyl group, and the carboxyl group forms a chemical bond with a material of the conductive polymer layer.
1 more element
A conductive particle, comprising:
- a core, wherein the core comprises a solid base and a porous layer coating the solid base, and a conductive carbon layer is at least partially received in the porous layer;
- the conductive carbon layer covering the core;
- and
- a conductive polymer layer provided on the conductive carbon layer.
1 more element
Dependencies are inferred from the claim text.