Multifunctional materials for temporary bonding
AssigneeBrewer Science Inc.
InventorsLuke M. Prenger, Qi Wu, Xiao Liu
Life of this patent
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Abstract
The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.
Claims15
A temporary bonding method comprising:
- providing a stack comprising:
- a first substrate having a back surface and a front surface;
- a bonding layer adjacent said front surface and comprising a polyazomethine;
- and
- a second substrate having a first surface adjacent said bonding layer;
- and
- exposing said bonding layer to laser energy so as to facilitate separation of said first and second substrates.
Dependencies are inferred from the claim text.