Silver-containing solution and method of forming silver catalyst layer in chemical plating
AssigneeIndustrial Technology Research Institute
InventorHung-Yuan Hsieh
Life of this patent
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Abstract
A method of forming a silver catalyst layer in chemical plating includes providing a substrate; applying a silver-containing solution onto the substrate; and applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate. The silver-containing solution includes silver ions, a diamine compound, a carboxylic acid compound, and a solvent. In addition, the substrate having the silver catalyst layer thereon can be immersed into a chemical plating solution to form a metal layer over the silver catalyst layer.
Claims15
A silver-containing solution, consisting of:
- silver ions;
- a diamine compound;
- a carboxylic acid compound;
- and
- a solvent.
A silver-containing solution consisting of:
- silver ions;
- a diamine compound;
- a carboxylic acid compound;
- a solvent;
- and
- a dispersant.
A method of forming a silver catalyst layer in chemical plating, comprising:
- providing a substrate;
- applying a silver-containing solution onto the substrate;
- applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate;
- wherein the silver-containing solution is consisting of:
- silver ions;
- a diamine compound;
- a carboxylic acid compound;
- and
- a solvent.
A method of forming a silver catalyst layer in chemical plating, comprising:
- providing a substrate;
- applying a silver-containing solution onto the substrate;
- applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate,
- wherein the silver-containing solution is consisting of:
- silver ions;
- a diamine compound;
- a carboxylic acid compound;
- a solvent;
- and
- a dispersant.
Dependencies are inferred from the claim text.