# US 12,022,606 B2 · Power supply apparatus

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- Number: US 12,022,606 B2
- Document ID: US12022606B2
- Status: Granted
- Kind: B2
- Application number: 17/046,082
- Filed: 2019-04-04
- Published: 2021-02-04
- Granted: 2024-06-25
- Earliest claimed: 2018-04-09
- Assignees: TDK-Lambda UK Limited
- Applicants: TDK-Lambda UK Limited
- Inventors: Alex Knill; Giorgio Ponzo; Robin Jeffery
- Web page: https://patentgrep.com/patent/US12022606B2

## CPC

- H05K 1/0207: {using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes}
- H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings}
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 7/20463: {Filling compound, e.g. potted resin}
- H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H05K 2203/1316: Moulded encapsulation of mounted components
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Power supply apparatus (10) comprising a circuit board (11) and one or more power devices (12) attached to a first surface (11a) of the circuit board (11). A plate (14a) composed of a thermally conductive plastic faces the first surface of the circuit board (11). A thermally conductive encapsulant (15) is provided between the first surfaces (11a) of the circuit board (11) and the plate (14a). The circuit board (11) comprises one or more heat-spreading layers (212*,213*) configured to enhance heat transfer in directions parallel to the first surface (11a) of the circuit board (11). The first surface (14aa″) of the plate (14a) may also be irregular and comprises one or more first regions (32) and one or more second regions (31) that are further from the first surface (11a) of the circuit board (11) than the one or more first regions (32), with the one or more power devices (12) being aligned with the one or more second regions (31).

## Claims

### Claim 1

A power supply apparatus, comprising:
a multi-layer circuit board having a printed circuit board layer on a lower surface and a printed circuit board layer on an upper surface;
one or more power devices attached to the printed circuit board layer on the lower surface of the multi-layer circuit board;
electronic components attached to the printed circuit board layer on the upper surface of the multi-layer circuit board;
a thermally conductive plate at least partly composed of a thermally conductive plastic, wherein an upper surface of the plate faces the printed circuit board layer on the lower surface of the multi-layer circuit board; and
a thermally conductive encapsulant provided to fill substantially all of the empty space between the printed circuit board layer on the lower surface of the multi-layer circuit board and the one or more power devices attached thereto and the upper surface of the thermally conductive plate to dissipate heat through the encapsulant to the thermally conducive plate; and
wherein the multi-layer circuit board further comprises a thermally conductive heat-spreading layer which is located no more than 150 micrometres from the printed circuit board layer on the lower surface of the multi-layer circuit board and which is thicker than that printed circuit board layer whereby the heat from the one or more power devices attached to that printed circuit board layer is spread across the multi-layer circuit board to dissipate through that printed circuit board layer and into the thermally conductive encapsulant.

### Claim 2 (depends on 1)

Apparatus according to claim 1 wherein the encapsulant has a thermal conductivity of between about 0.5 and 2 Wm−1K−1.

### Claim 3 (depends on 1)

Apparatus according to claim 1 wherein the thermally conductive plastic is at least partly composed of a polymer and a thermally-conductive additive.

### Claim 4 (depends on 1)

Apparatus according to claim 1 wherein the thermally conductive plastic has a thermal conductivity of between about 1 and 10 Wm−1K−1.

### Claim 5 (depends on 1)

Apparatus according to claim 1, wherein the multi-layer circuit board further comprises a thermally conductive heat-spreading layer which is located no more than 150 micrometres from the printed circuit board layer on the upper surface of the multi-layer circuit board and which is thicker than that printed circuit board layer whereby the heat from the electronic components attached to that printed circuit board layer is spread across the multi-layer circuit board to dissipate there through and into the thermally conductive encapsulant.

### Claim 6 (depends on 1)

Apparatus according to claim 1 wherein the printed circuit board layer on the lower surface of the multi-layer circuit board comprises one or more copper floods in a vicinity of the one or more of the power devices.

### Claim 7 (depends on 1)

Apparatus according to claim 1 wherein the thermally conductive plate corresponds to a base of an enclosure having sidewalls extending from the first upper surface of the thermally conductive plate to a rim which supports the multi-layer circuit board.

### Claim 8 (depends on 1)

Apparatus according to claim 1 wherein the upper surface of the thermally conductive plate and a profile of the one or more power devices attached to the printed circuit board layer on the lower surface of the multi-layer circuit board match together.

### Claim 9 (depends on 8)

Apparatus according to claim 8 wherein a distance between the upper surface of the thermally conductive plate and a profile of the one or more power devices attached to the printed circuit board layer on the lower surface of the multi-layer circuit board is no more than 1 millimetre over substantially all of the lower surface of the multi-layer circuit board.