Array camera module and application thereof

An array camera module, comprising at least two optical lenses and a circuit board assembly, wherein the circuit board assembly further comprises:

• one circuit board;
• at least two photosensitive chips, wherein at least one of the photosensitive chips is conductively connected to a front surface of the circuit board, and at least one other of the photosensitive chips is accommodated in at least one accommodation space implemented as a through-hole in the circuit board, each of the optical lenses is held in a photosensitive path of each of the photosensitive chips respectively, and there is a height difference between a photosensitive surface of at least one of the photosensitive chips and a photosensitive surface of at least one other of the photosensitive chips;
• at least one electronic component, wherein each of the electronic components is conductively connected to the circuit board respectively, and at least one of the electronic components is located on a back face of the circuit board;
• and
• an embedding portion which is integrally bonded to the back face of the circuit board,
• wherein the embedding portion is formed by solidifying a fluid-state molding material which is added into a lower molding space between the circuit board and a lower die by filling up the lower molding space through a lower communication channel and performing a demolding operation of the lower die.