# US 12,021,297 B2 · Integrated circuit package comprising a crossed dipole antenna > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,021,297 B2 - Document ID: US12021297B2 - Status: Granted - Kind: B2 - Application number: 17/669,470 - Filed: 2022-02-11 - Published: 2022-08-18 - Granted: 2024-06-25 - Earliest claimed: 2021-02-12 - Assignees: Sivers Wireless AB - Applicants: Sivers Wireless AB - Inventors: Erik Öjefors; Dragos Dancila; Imran Aziz; Johanna Hanning - Web page: https://patentgrep.com/patent/US12021297B2 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 9/28: Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines (waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00) - H01Q 19/106: {using two or more intersecting plane surfaces, e.g. corner reflector antennas} - H01Q 19/108: {Combination of a dipole with a plane reflecting surface (H01Q19/106 takes precedence; strip line H01Q9/065)} - H01Q 21/062: {using dipole aerials; (H01Q21/067, H01Q21/068 take precedence)} - H01Q 21/08: the units being spaced along or adjacent to a rectilinear path {(waveguide fed H01Q21/0037)} - H01Q 21/26: Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre - H01Q 1/241: {used in mobile communications, e.g. GSM (H01Q1/247, H01Q1/248 take precedence)} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An integrated circuit package is provided. The integrated circuit package comprises a transceiver radio-frequency integrated circuit, RFIC, and at least one antenna array formed in a redistribution metal layer of the integrated circuit package, and is arranged in a fan-out area of the RFIC. The at least one antenna array comprises at least one crossed dipole antenna. Each crossed dipole antenna comprises a first dipole comprising two first legs, and a second dipole comprising two second legs, and two leg pairs, each leg pair comprising one first leg of the first dipole and one second leg of the second dipole, and two feed lines. Each feed line is coupled to a respective leg pair at a center of the crossed dipole antenna. At least a part of each feed line is arranged between the two leg pairs. ## Claims ### Claim 1 An integrated circuit package, comprising: a transceiver radio-frequency integrated circuit (RFIC); a redistribution metal layer (RDL); at least one antenna array formed in the RDL and arranged in a fan-out area, the at least one antenna array comprising at least one crossed dipole antenna comprising: a first dipole comprising two first legs; and a second dipole comprising two second legs, wherein a respective first leg and a respective second leg of each of the first dipole and the second dipole cooperate to define respective leg pairs, such that there are two leg pairs; and at least one pair of feed lines formed in the RDL, wherein each feed line is coupled between a respective leg pair and the RFIC, and wherein the at least one pair of feed lines extends from a center of the at least one crossed dipole antenna towards the RFIC between the two leg pairs. ### Claim 2 (depends on 1) The integrated circuit package of claim 1, wherein the at least one antenna array and the at least one pair of feed lines are arranged in a plane of the RDL. ### Claim 3 (depends on 1) The integrated circuit package of claim 1, wherein the at least one pair of feed lines extends at an angle of 35-45 degrees with regards to a longitudinal axis defined by a neighboring first leg of a first leg pair. ### Claim 4 (depends on 3) The integrated circuit package of claim 3, wherein the at least one pair of feed lines extends at an angle of 35-45 degrees with regards to a longitudinal axis defined by a neighboring second leg of a second leg pair. ### Claim 5 (depends on 1) The integrated circuit package of claim 1, wherein the at least one crossed dipole antenna is a circular polarized antenna. ### Claim 6 (depends on 1) The integrated circuit package of claim 1, wherein a length of a first leg is between 1.52 and 1.68 of a length of a second leg. ### Claim 7 (depends on 1) The integrated circuit package of claim 1, wherein the two first legs have a first length such that the first dipole of the at least one crossed dipole antenna has a first angle of input admittance and the two second legs have a second length such that the second dipole of the at least one crossed dipole antenna has a second angle of input admittance. ### Claim 8 (depends on 7) The integrated circuit package of claim 7, wherein the first angle of input admittance and the second angle of input admittance differ by 90°. ### Claim 9 (depends on 1) The integrated circuit package of claim 1, wherein each of the at least one pair of feed lines are fed a signal by the RFIC, wherein the signals fed to the at least one pair of feed lines by the RFIC have a phase difference of 180°. ### Claim 10 (depends on 1) The integrated circuit package of claim 1, wherein at least two antenna arrays are formed in the RDL and arranged in respective fan-out areas arranged at opposites sides of the RFIC. ### Claim 11 (depends on 10) The integrated circuit package of claim 10, wherein each antenna array of the at least two antenna arrays comprises at least four crossed dipole antennas. ### Claim 12 (depends on 10) An apparatus comprising: the integrated circuit package of claim 10; and a heatsink element arranged on the RFIC. ### Claim 13 (depends on 12) The apparatus of claim 12, wherein each antenna array of the at least two antenna arrays comprises at least four crossed dipole antennas. ### Claim 14 (depends on 10) A system comprising: the integrated circuit package of claim 10; a heatsink arranged on a first side of the RFIC; and a printed circuit board (PCB), wherein the integrated circuit package is mounted to the PCB such that the PCB is on a second side of the RFIC. ### Claim 15 (depends on 14) The system of claim 14, wherein the PCB comprises a reflective metal layer and a plurality of vias, and the RFIC is adjacent to the plurality of vias. ### Claim 16 (depends on 15) The system of claim 15, wherein at least one antenna array of the at least two antenna arrays is configured for communication at a specific wavelength, and is arranged at a first distance from the reflective metal layer and a second distance from the plurality of vias, wherein the first distance is a quarter of the specific wavelength, and the second distance is between one-half and three-quarters of the specific wavelength. ### Claim 17 (depends on 15) The system of claim 15, wherein the heatsink, the RFIC, and the plurality of vias form a reflector wall. ### Claim 18 (depends on 17) The system of claim 17, wherein the reflector wall is configured to increase a gain of the at least two antenna arrays. ### Claim 19 (depends on 17) The system of claim 17, wherein the reflective metal layer and the reflector wall form a corner reflector antenna. ### Claim 20 (depends on 19) The system of claim 19, wherein the corner reflector antenna is configured to increase a gain of the at least two antenna arrays.