Molding device
AssigneeKabushiki Kaisha Toyota Chuo Kenkyusho
InventorsNorio Fujitsuka, Keiichi Shimaoka, Teruhisa Akashi, Shota Harada, Yuuki Inagaki, Katsuaki Goto, Keitaro Ito, Takahiko Yoshida
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AssigneeKabushiki Kaisha Toyota Chuo Kenkyusho
InventorsNorio Fujitsuka, Keiichi Shimaoka, Teruhisa Akashi, Shota Harada, Yuuki Inagaki, Katsuaki Goto, Keitaro Ito, Takahiko Yoshida
Estimating the term…
A molding device may comprise a mold, a plate, and a ring. The mold may comprise: a lower surface; an upper surface parallel to the lower surface; a hole defined in a part of the upper surface; and a through hole extending from a bottom surface of the hole to the lower surface of the mold. The plate may comprise a surface with a gas outlet defined therein. The ring may be arranged between the lower surface of the mold and the surface of the plate and connecting the mold and the plate. The ring may surround the through hole exposed on the lower surface of the mold and the gas outlet exposed on the surface of the plate. In a region where the ring is not arranged, a space may be defined between the lower surface of the mold and the surface of the plate.
A molding device comprising a mold, a plate, and a ring, wherein
A molding device comprising a mold, a plate, a first ring and a second ring, wherein
Dependencies are inferred from the claim text.