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US 12,017,392 B2Granted
Overmoulded printed electronic parts and methods for the manufacture thereof
AssigneesNational Research Council of Canada, E2IP Technologies Inc.
InventorsPaul Arthur Trudeau, Arnold Jason Kell, Xiangyang Liu, Olga Mozenson
Life of this patent
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Abstract
The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.
Claims23
A method for manufacturing an overmoulded printed electronic part, the method comprising:
- depositing a low temperature molecular ink on a substrate to form a non-conductive trace of the ink on a first surface of the substrate;
- sintering the non-conductive trace of the ink on the substrate to form a conductive trace on the first surface of the substrate;
- injecting an overmoulding resin or a precursor thereto over the conductive trace on the first surface of the substrate;
- and
- hardening the overmoulding resin or curing the precursor thereto to obtain the overmoulded printed electronic part.
2 more elements
A method for manufacturing an overmoulded printed electronic part, the method comprising:
- injecting a precursor to a thermoset overmoulding resin over a conductive trace on a first surface of a substrate;
- and
- curing the precursor to the thermoset overmoulding resin to obtain the overmoulded printed electronic part,
- wherein the conductive trace on the first surface of the substrate is obtained by a method comprising:
- depositing a low temperature molecular ink on the substrate to form a non-conductive trace of the ink on the first surface of the substrate;
- and
- curing the non-conductive trace of the ink on the substrate to form the conductive trace on the first surface of the substrate.
4 more elements
An overmoulded printed electronic part comprising:
- a conductive trace coupled to a first surface of a substrate;
- and
- a thermoset resin overmoulded over the conductive trace coupled to the first surface of the substrate,
- wherein the conductive trace is a conductive silver trace manufactured from a low temperature molecular ink wherein the molecular ink comprises:
- a silver carboxylate;
- an organic amine compound;
- an organic polymer binder;
- a surface tension modifier;
- and a solvent.
6 more elements
Dependencies are inferred from the claim text.