Robot apparatus for soldering

A robot apparatus for soldering, comprising:

• a frame body having arranged therein:
• a single robot having a plurality of joints;
• operation tools each of which is configured to be individually connected to the robot;
• a solder pot having a container for melting and storing solder and a nozzle from which the solder flows out;
• a table secured to the frame body of the robot apparatus and disposed above the single robot, wherein the table supports a workpiece;
• a placement member supported by the frame body of the robot apparatus, arranged below the table and upon which the operation tools and the solder pot are placed, wherein the placement member is formed to include support pillars configured to support at least one solder bar placed therebetween;
• and
• a controller for controlling the single robot,
• wherein
• the operation tools include a flux ejection tool for ejecting soldering flux, and a support tool for supporting the solder pot,
• the single robot has a function of automatically changing its position and posture to connect to and exchange the operation tools during a plurality of processes for the soldering to provide continuous performance of operations related to the soldering of the workpiece,
• the operation tools and the solder pot are placed on the placement member, and
• the controller performs a flux application control for coupling the flux ejection tool to the single robot and applying flux to a portion of the workpiece to be soldered, a preheating control for coupling the support tool to the single robot and arranging the solder pot below the workpiece so that the workpiece is heated by heat released from the solder pot, and a supply control for moving the nozzle of the solder pot closer to the workpiece and supplying the solder to the portion of the workpiece to be soldered.