# US 12,016,247 B2 · Package comprising an integrated passive device configured as a cap for a filter > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,016,247 B2 - Document ID: US12016247B2 - Status: Granted - Kind: B2 - Application number: 17/005,168 - Filed: 2020-08-27 - Published: 2022-03-03 - Granted: 2024-06-18 - Earliest claimed: 2020-08-27 - Assignees: QUALCOMM Incorporated - Applicants: QUALCOMM Incorporated - Inventors: Changhan Hobie Yun; Nosun Park; Daniel Daeik Kim; Paragkumar Ajaybhai Thadesar; Sameer Sunil Vadhavkar - Web page: https://patentgrep.com/patent/US12016247B2 ## CPC - H03H 9/0547: {consisting of a vertical arrangement (H03H9/0566 takes precedence)} - H10N 30/704: {based on piezoelectric or electrostrictive films or coatings} - H03H 3/02: for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) - H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves - H03H 9/02015: {Characteristics of piezoelectric layers, e.g. cutting angles} - H03H 9/02535: {of surface acoustic wave devices} - H03H 9/1014: {the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device} - H03H 9/1071: {the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract A package that includes an integrated device, an integrated passive device and a void. The integrated device is configured as a filter. The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate. The integrated passive device is coupled to the integrated device. The integrated passive device is configured as a cap for the integrated device. The void is located between the integrated device and the integrated passive device. ## Claims ### Claim 1 A package comprising: an integrated device configured as an acoustic filter, the integrated device comprising: a substrate comprising a piezoelectric material; and at least one metal layer coupled to a first surface of the substrate, wherein at least part of the at least one metal layer is configured as a transducer that touches the piezoelectric material of the substrate; an integrated passive device coupled to the integrated device, wherein the integrated passive device is configured as a cap for the integrated device configured as the acoustic filter, wherein the integrated passive device includes a metal-insulator-metal (MIM) capacitor defined by a first interconnect, an insulation layer, and a second interconnect, and wherein the MIM capacitor is located on a frontside of the integrated passive device; and a void located between the integrated device and the integrated passive device. ### Claim 2 (depends on 1) The package of claim 1, wherein a back side of the integrated passive device is coupled to the integrated device. ### Claim 3 (depends on 1) The package of claim 1, further comprising at least one outer surface interconnect located on a surface of the integrated passive device, wherein the integrated device is configured to be electrically coupled to the integrated passive device through the at least one outer surface interconnect. ### Claim 4 (depends on 1) The package of claim 1, wherein the integrated passive device includes an inductor. ### Claim 5 (depends on 1) The package of claim 1, wherein the integrated device and the integrated passive device are configured to allow an electrical signal from the integrated device to travel through the integrated passive device. ### Claim 6 (depends on 1) The package of claim 1, wherein the integrated device is coupled to the integrated passive device through a seal ring and/or a polymer frame. ### Claim 7 (depends on 6) The package of claim 6, wherein the integrated device is configured to be electrically coupled to the integrated passive device through at least one interconnect coupled to the integrated device and the integrated passive device, and wherein the at least one interconnect is located between the integrated device and the integrated passive device. ### Claim 8 (depends on 1) The package of claim 1, wherein the package is incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle. ### Claim 9 (depends on 1) The package of claim 1, wherein the substrate comprising the piezoelectric material comprises the substrate and a piezoelectric layer formed over and touching the substrate, and wherein the at least part of the at least one metal layer that is configured as the transducer touches the piezoelectric layer. ### Claim 10 (depends on 1) The package of claim 1, wherein the acoustic filter is configured to operate as a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter. ### Claim 11 An apparatus comprising: means for acoustic filtering comprising: a substrate comprising a piezoelectric material; and at least one transducer coupled to and touching the piezoelectric material of the substrate; means for passive functionality coupled to the means for acoustic filtering, wherein the means for passive functionality is configured as a cap for the means for acoustic filtering, wherein the means for passive functionality includes a metal-insulator-metal (MIM) capacitor defined by a first interconnect, an insulation layer and a second interconnect; and a void located between the means for acoustic filtering and the means for passive functionality, wherein the first interconnect of the MIM capacitor of the means for passive functionality is exposed to the void located between the means for acoustic filtering and the means for passive functionality. ### Claim 12 (depends on 11) The apparatus of claim 11, wherein the means for passive functionality includes a means for inductance. ### Claim 13 (depends on 11) The apparatus of claim 11, the means for acoustic filtering and the means for passive functionality are configured to allow an electrical signal from the means for acoustic filtering to travel through the means for passive functionality. ### Claim 14 (depends on 11) The apparatus of claim 11, wherein the means for acoustic filtering is coupled to the means for passive functionality through a seal ring and/or a polymer frame. ### Claim 15 (depends on 11) The apparatus of claim 11, wherein the means for acoustic filtering is configured to operate as a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter. ### Claim 16 (depends on 11) The apparatus of claim 11, wherein the at least one transducer is exposed to the void located between the means for acoustic filtering and the means for passive functionality. ### Claim 17 (depends on 11) The apparatus of claim 11, wherein the apparatus is incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle. ### Claim 18 A method for fabricating a package, comprising: providing an integrated device configured as an acoustic filter, the integrated device comprising: a substrate comprising a piezoelectric material; and at least one metal layer coupled to a first surface of the substrate, wherein at least part of the at least one metal layer is configured as a transducer that touches the piezoelectric material of the substrate; and coupling an integrated passive device to the integrated device, wherein the integrated passive device is configured as a cap for the integrated device and includes a metal-insulator-metal (MIM) capacitor defined by a first interconnect, an insulation layer, and a second interconnect, wherein coupling the integrated passive device to the integrated device forms a void located between the integrated device and the integrated passive device where the first interconnect of the MIM capacitor is exposed to the void. ### Claim 19 (depends on 18) The method of claim 18, wherein a back side of the integrated passive device is coupled to the integrated device. ### Claim 20 (depends on 18) The method of claim 18, wherein the integrated passive device includes an inductor. ### Claim 21 (depends on 18) The method of claim 18, wherein the integrated device and the integrated passive device are configured to allow an electrical signal from the integrated device to travel through the integrated passive device. ### Claim 22 (depends on 18) The method of claim 18, wherein the integrated device is coupled to the integrated passive device through a seal ring and/or a polymer frame.