# US 12,016,187 B2 · Encapsulating composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,016,187 B2 - Document ID: US12016187B2 - Status: Granted - Kind: B2 - Application number: 16/972,233 - Filed: 2019-09-10 - Published: 2021-07-29 - Granted: 2024-06-18 - Earliest claimed: 2018-09-11 - Assignees: LG Chem, Ltd. - Applicants: LG Chem, Ltd. - Inventors: Ji Won Kwak; Joon Hyung Kim; Kook Hyun Choi; Mi Lim Yu; Yung Jong Lee - Web page: https://patentgrep.com/patent/US12016187B2 ## CPC - C09D 11/38: characterised by non-macromolecular additives other than solvents, pigments or dyes - C08G 59/226: {Mixtures of di-epoxy compounds} - C08G 59/24: carbocyclic - C08G 65/18: Oxetanes - C08K 5/01: Hydrocarbons {(C08K5/0091 takes precedence)} - C09D 11/03: characterised by features other than the chemical nature of the binder - C09D 11/101: Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing - C09K 3/10: {Materials in mouldable or extrudable form} for sealing or packing joints or covers (filling pastes C09D5/34) - H10K 10/88: Passivation; Containers; Encapsulations - H10K 59/873: {Encapsulations} - Y02E 10/549: Organic PV cells - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem. ## Claims ### Claim 1 An encapsulating composition comprising an aliphatic carbobicycle compound having one or more functional groups; an epoxy compound having a cyclic structure in the molecular structure; a linear or branched aliphatic epoxy compound; and a compound having an oxetane group, wherein the aliphatic carbobicycle compound is included in a range of 1 part by weight to 50 parts by weight relative to 100 parts by weight of the encapsulating composition, the epoxy compound having a cyclic structure in the molecular structure is included in a range of 5 parts by weight to 150 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound, the linear or branched aliphatic epoxy compound is included in a range of 20 parts by weight to 300 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound, and the compound having an oxetane group is included in a range of 40 parts by weight to 800 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound, and wherein the encapsulating composition has a viscosity of 50 cP or less as measured at room temperature. ### Claim 2 (depends on 1) The encapsulating composition according to claim 1, wherein an organic layer formed by curing the encapsulating composition has a dielectric constant in a range of 2.0 to 3.5. ### Claim 3 (depends on 1) The encapsulating composition according to claim 1 further comprising a photoinitiator. ### Claim 4 (depends on 3) The encapsulating composition according to claim 3, wherein the photoinitiator is included in a range of 5 parts by weight to 80 parts by weight relative to 100 parts by weight of the aliphatic carbobicycle compound. ### Claim 5 (depends on 1) The encapsulating composition according to claim 1, wherein the encapsulating composition is photo-cured at a light quantity of 300 mJ/cm2 to 6,000 mJ/cm2. ### Claim 6 (depends on 1) The encapsulating composition according to claim 1, wherein a cured product of the encapsulating composition has pencil hardness of 2H or more. ### Claim 7 (depends on 1) The encapsulating composition according to claim 1, wherein the encapsulating composition is an ink composition in a solventless form. ### Claim 8 (depends on 1) The encapsulating composition according to claim 1, wherein the aliphatic carbobicycle compound has one or more functional groups selected from an epoxy group or a (meth)acryl group. ### Claim 9 (depends on 1) The encapsulating composition according to claim 1, wherein the aliphatic carbobicycle compound is bicyclo[2.2.1]heptane, biscyclo[3.1.1]heptane, bicyclo[3.2.1]octane, bicyclo[4.3.2]undecane, or biscyclo[3.3.3]undecane. ### Claim 10 (depends on 1) The encapsulating composition according to claim 1, wherein the aliphatic carbobicycle compound is represented by Formula 1 or Formula 2 below: in Formulas 1 and 2 above, R represents a C1-6 alkylene group unsubstituted or substituted with a C1-4 alkyl group, and R1 to R6 each independently represent hydrogen, a C1-4 alkyl group, or a (meth)acryl group, or together with an adjacent substituent form an alicyclic ring or an epoxy group, where Formulas 1 and 2 comprise at least one (meth)acryl group or epoxy group. ### Claim 11 (depends on 1) The encapsulating composition according to claim 1, wherein the epoxy compound having a cyclic structure in the molecular structure is 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate, vinylcyclohexene dioxide, 1,4-cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylate), 1,2-epoxy-4-vinylcyclohexane, 1,1′-bi-7-oxabicyclo[4.1.0]heptane, or derivatives thereof. ### Claim 12 (depends on 1) The encapsulating composition according to claim 1, wherein the linear or branched aliphatic epoxy compound is 1,4-butanediol diglycidyl ether, ethyleneglycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, propyleneglycol diglycidyl ether, diethyleneglycol diglycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether or neopentylglycol diglycidyl ether. ### Claim 13 (depends on 1) The encapsulating composition according to claim 1, wherein the compound having an oxetane group is bis[1-ethyl(3-oxetyl)]methyl ether, 3-ethyl-3-(cyclohexyl)methyl oxetane, oxetane silicate, 3-ethyl-3-hydroxymethyl-oxetane, 1,4-bis[{(3-ethyloxetan-1-yl)methoxy}methyl]benzene, 3-ethyl-3-[(2-ethylhexyloxy)methyl]oxetane, 3-ethyl-3-hydroxymethyl-oxetane, 4,4′-bis[(3-ethyl-3-oxetanyl)methoxymethyl]bisphenyl, bis[(3-ethyl-3-oxetanyl)methyl] terephthalate or (3-ethyl-3-oxetanyl)methoxymethyl methacrylate.