# US 12,016,165 B2 · Shield package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,016,165 B2 - Document ID: US12016165B2 - Status: Granted - Kind: B2 - Application number: 17/295,975 - Filed: 2019-11-19 - Published: 2022-01-27 - Granted: 2024-06-18 - Earliest claimed: 2018-11-21 - Assignees: Tatsuta Electric Wire & Cable Co., Ltd. - Applicants: Tatsuta Electric Wire & Cable Co., Ltd. - Inventors: Hiroaki Umeda; Hidetoshi Noguchi; Hajime Nakazono; Sougo Ishioka - Web page: https://patentgrep.com/patent/US12016165B2 ## CPC - H05K 9/003: {made from non-conductive materials comprising an electro-conductive coating (H05K9/0031 takes precedence)} - G06K 19/06037: {multi-dimensional coding} - H05K 9/0081: {Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence)} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 74/10: characterised by their shape or disposition - G06K 19/06159: {the marking being relief type, e.g. three-dimensional bar codes engraved in a support} - H10W 46/106: {digital information, e.g. bar codes} - H10W 46/607: {Located on parts of packages, e.g. on encapsulations or on package substrates} - H10W 74/473: {containing a filler} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present invention aims to provide a shield package having a highly distinctive patterned portion formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a sealing material, and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Sal (autocorrelation length) of the non-patterned portion to Sal of the patterned portion is as follows: (Sal of non-patterned portion)/(Sal of patterned portion)>4.0. ## Claims ### Claim 1 A shield package comprising: a package in which an electronic component is sealed with a sealing material; and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Sal of the non-patterned portion to Sal of the patterned portion is as follows: (Sal of non-patterned portion)/(Sal of patterned portion)>4.0, where Sal represents an autocorrelation length. ### Claim 2 (depends on 1) The shield package according to claim 1, wherein a surface of the sealing material comprises a drawing area drawn with lines and/or dots by aggregation of multiple grooves, and a non-drawing area other than the drawing area, multiple depressions originating from the grooves are formed on a surface of the shield layer on the drawing area, and the depressions are aggregated to draw the patterned portion with lines and/or dots. ### Claim 3 (depends on 2) The shield package according to claim 2, wherein at least some of the multiple grooves each have a line shape. ### Claim 4 (depends on 3) The shield package according to claim 3, wherein at least some of the multiple grooves are formed linearly and in parallel to each other. ### Claim 5 (depends on 4) The shield package according to claim 4, wherein the grooves adjacent to each other are arranged at an interval of 10 to 100 μm. ### Claim 6 (depends on 2) The shield package according to claim 2, wherein at least some of the multiple grooves are formed in a grid shape. ### Claim 7 (depends on 6) The shield package according to claim 6, wherein each cell of the grid formed by the grooves has a width of 10 to 100 μm. ### Claim 8 (depends on 2) The shield package according to claim 2, wherein each groove has a width of 5 to 100 μm. ### Claim 9 (depends on 2) The shield package according to claim 2, wherein each groove has a depth of 5 μm or more. ### Claim 10 (depends on 1) The shield package according to claim 1, wherein the patterned portion is a two-dimensional code. ### Claim 11 A shield package comprising: a package in which an electronic component is sealed with a sealing material; and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Smr1 of the non-patterned portion to Smr1 of the patterned portion is as follows: (Smr1 of non-patterned portion)/(Smr1 of patterned portion)>1.0, where Smr1 represents a ratio of the area of the material at the intersection line which separates the protruding hills from the core surface to the evaluation area. ### Claim 12 A shield package comprising: a package in which an electronic component is sealed with a sealing material; and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Ssk of the non-patterned portion to Ssk of the patterned portion is as follows: (Ssk of non-patterned portion)/(Ssk of patterned portion)<5.0, where Ssk represents skewness.