# US 12,016,159 B2 · Cooling system with a porous foam heat exchanger and a positive displacement air pump > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,016,159 B2 - Document ID: US12016159B2 - Status: Granted - Kind: B2 - Application number: 17/454,317 - Filed: 2021-11-10 - Published: 2023-05-11 - Granted: 2024-06-18 - Earliest claimed: 2021-11-10 - Assignees: Dell Products L.P. - Applicants: Dell Products L.P. - Inventors: Travis C. North; John T. Morrison; Laurent Andrew Regimbal - Web page: https://patentgrep.com/patent/US12016159B2 ## CPC - H05K 7/20736: {within cabinets for removing heat from server blades} - F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)} - F28D 15/0275: {Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores} - F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} - F28F 13/003: {by using permeable mass, perforated or porous materials (F28F13/18 takes precedence)} - G06F 1/20: Cooling means - F28D 2021/0029: {Heat sinks} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract A cooling system for an information handling system in a portable chassis comprises a vapor chamber for transferring heat away from components, a porous heat exchanger for receiving heat from the vapor chamber, an air pump of receiving airflow at a first air pressure and generating a second airflow at a second air pressure greater than the first airflow. The porous heat exchanger may comprise one of a plurality of sides of an internal air chamber configured to allow the air pump to generate the second air pressure two to three orders of magnitude greater than the first air pressure. An air pump such as a piezoelectric air pump can generate airflow at a pressure that is two to three orders of magnitude greater than possible using a traditional blower. ## Claims ### Claim 1 A cooling system for an information handling system in a portable chassis, the cooling system comprising: a vapor chamber comprising a vapor chamber first surface and a vapor chamber second surface, wherein at least one of the vapor chamber first surface and the vapor chamber second surface is in contact with one or more heat generating components in the chassis; a first porous heat exchanger in sealed contact with the vapor chamber; a second porous heat exchanger; an air pump in sealed contact with the first porous heat exchanger, the air pump comprising an air pump first surface having an air pump inlet and an air pump second surface opposite the first surface, the air pump second surface having an air pump outlet; and an internal air chamber comprising a plurality sides, the internal air chamber defined by the air pump second surface, the vapor chamber first surface and the plurality of sides, wherein at least one side comprises the first porous heat exchanger and at least another side comprises the second porous heat exchanger, wherein: the vapor chamber is configured to conduct heat away from the one or more heat generating components to the first porous heat exchanger, the air pump is configured to draw a first airflow at a first air pressure into the air pump inlet and generate a second airflow out the air pump second surface at a second air pressure in the internal air chamber, whereby the second pressure forces the second airflow through the first porous heat exchanger, and the first porous heat exchanger is configured to transfer heat from the vapor chamber to the second airflow; and a vent configured to allow the second airflow to exit to the ambient environment, wherein the first porous heat exchanger is positioned relative to the first vent on the chassis and the second porous heat exchanger is positioned relative an internal region of the chassis. ### Claim 2 (depends on 1) The cooling system of claim 1, wherein contact between the air pump second surface and the plurality of sides comprises sealed contact. ### Claim 3 (depends on 2) The cooling system of claim 2, wherein the sealed contact comprises a gasket positioned between the porous heat exchanger and the air pump. ### Claim 4 (depends on 2) The cooling system of claim 2, wherein the sealed contact between the porous heat exchanger and the vapor chamber comprises a gasket. ### Claim 5 (depends on 1) The cooling system of claim 1, wherein the second airflow is forced through the first porous heat exchanger to the ambient environment. ### Claim 6 (depends on 1) The cooling system of claim 1, wherein the first porous heat exchanger comprises a first porosity and the second porous heat exchanger comprises a second porosity. ### Claim 7 (depends on 6) The method of claim 6, comprising positioning a gasket between the air pump second surface and the plurality of sides to form the sealed contact. ### Claim 8 A method of manufacturing a cooling system for an information handling system in a portable chassis, the method comprising: positioning a vapor chamber in the chassis, the vapor chamber comprising a vapor chamber first surface and a vapor chamber second surface, wherein positioning the vapor chamber in the chassis causes contact between at least one of the vapor chamber first surface and the vapor chamber second surface with one or more components of the information handling system in the chassis; positioning a first porous heat exchanger in sealed contact with the vapor chamber; positioning a second porous heat exchanger relative to an internal region of the chassis; and positioning an air pump in sealed contact with a plurality of sides of an internal air chamber, the air pump comprising an air pump first surface having an air pump inlet and an air pump second surface opposite the first surface, the air pump second surface having an air pump outlet, wherein the plurality of sides comprises the first porous heat exchanger as one side, wherein the vapor chamber first surface, the air pump second surface and the plurality of sides form the internal air chamber, wherein another side of the plurality of sides comprises the second porous heat exchanger, wherein the vapor chamber conducts heat away from the one or more components of the information handling system to the first porous heat exchanger, the air pump draws a first airflow into the air pump inlet at a first air pressure and generates a second airflow at a second air pressure in the internal air chamber that is higher than the first air pressure, whereby the second airflow is forced through the first porous heat exchanger, and the first porous heat exchanger transfers heat from the vapor chamber to the second airflow, wherein the first porous heat exchanger is positioned relative to a first vent on the chassis. ### Claim 9 (depends on 8) The method of claim 8, comprising positioning the gasket between the porous heat exchanger and the air pump second surface to form the sealed contact. ### Claim 10 (depends on 8) The method of claim 8, wherein the first porous heat exchanger comprises a first porosity and the second porous heat exchanger comprises a second porosity. ### Claim 11 A portable chassis for an information handling system comprising a plurality of components that generate heat during processing instructions, the portable chassis comprising: a vapor chamber comprising a vapor chamber first surface and a vapor chamber second surface, wherein at least one of the vapor chamber first surface and the vapor chamber second surface is in contact with one or more of the plurality of heat generating components in the chassis; a first porous heat exchanger in sealed contact with the vapor chamber; a second porous heat exchanger; an air pump in sealed contact with the porous heat exchanger, the air pump comprising an air pump first surface having an air pump inlet and an air pump second surface opposite the air pump first surface, the air pump second surface having an air pump outlet; an internal air chamber comprising a plurality sides, the internal air chamber defined by the air pump second surface, the vapor chamber first surface and plurality of sides, wherein at least one side comprises the first porous heat exchanger and at least another side comprises the second porous heat exchanger; and a cover comprising a vent, wherein: the vapor chamber is configured to conduct heat away from the one or more heat generating components to the first porous heat exchanger, the air pump is configured to draw a first airflow at a first air pressure into the air pump inlet and generate a second airflow out the air pump second surface at a second air pressure in the internal air chamber, whereby the second pressure forces the second airflow through the first porous heat exchanger, and the first porous heat exchanger is configured to transfer heat from the vapor chamber to the second airflow; and the vent is configured to allow the second airflow to exit to the ambient environment, wherein the first porous heat exchanger is positioned relative to the first vent on the chassis and the second porous heat exchanger is positioned relative an internal region of the chassis.