# US 12,016,155 B2 · Heat sink with improved thermal conductivity

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- Number: US 12,016,155 B2
- Document ID: US12016155B2
- Status: Granted
- Kind: B2
- Application number: 17/257,924
- Filed: 2019-07-11
- Published: 2021-09-16
- Granted: 2024-06-18
- Earliest claimed: 2018-07-12
- Assignees: Continental Automotive France; Continental Automotive GmbH
- Applicants: Continental Automotive France; Continental Automotive GmbH
- Inventors: Philippe Lopez
- Web page: https://patentgrep.com/patent/US12016155B2

## CPC

- H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing}
- F28F 3/022: {the means being wires or pins}
- F28F 3/06: the means being attachable to the element
- F28F 21/02: of carbon, e.g. graphite
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
- F28F 2215/02: Arrangements of fins common to different heat exchange sections, the fins being in contact with different heat exchange media
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)

## Abstract

A heat sink including a first face in contact with electronic components generating heat to be removed and a second face in contact with the medium into which to dissipate the heat generated by the electronic components, including: at least one device for enhancing the thermal conductivity including a dome-shaped surface, a pin and a lateral section of revolution about the pin, the dome-shaped surface being connected to one end of a pin and to the lateral section of revolution, the dome-shaped surface being arranged on the second-face side, the free end of the pin being arranged on the first-face side.

## Claims

### Claim 1

A heat sink comprising:
a first face in contact with electronic components generating heat to be removed and a second face in contact with a medium into which to dissipate the heat generated by the electronic components,
at least one device for enhancing a thermal conductivity comprising a dome-shaped surface, a pin and a lateral section surrounding the pin, the dome-shaped surface being connected to one end of the pin and to the lateral section, the dome-shaped surface having a round tip extending in a direction away from the first face,
the dome-shaped surface being arranged on the second face, a free end of the pin being arranged on the first face,
wherein the first face is a planar first face, and
wherein the free end of the pin is on the planar first face, and a surface of the lateral section opposite the dome-shaped surface is arranged on the planar first face.

### Claim 2 (depends on 1)

The heat sink as claimed in claim 1, wherein the heat sink is made of a material comprising graphite fibers held substantially parallel in a composite matrix.

### Claim 3 (depends on 1)

The heat sink as claimed in claim 1, wherein the second face is provided with at least one means for increasing an exchange surface of the heat sink with the medium into which the heat generated by the electronic components is to be dissipated.

### Claim 4 (depends on 1)

The heat sink as claimed in claim 1, comprising two neighboring devices for enhancing the thermal conductivity are connected through the lateral section of each of the two neighboring devices.

### Claim 5 (depends on 1)

The heat sink as claimed in claim 1, wherein a width of the pin is equal to a thickness of the lateral section.

### Claim 6 (depends on 1)

The heat sink as claimed in claim 1, wherein the lateral section has an angle of 30° with the pin of the at least one device for enhancing the thermal conductivity.

### Claim 7 (depends on 1)

The heat sink as claimed in claim 1, comprising removable attachment means.

### Claim 8 (depends on 1)

The heat sink as claimed in claim 1, wherein the second face is provided with a fin for increasing an exchange surface of the heat sink with the medium into which the heat generated by the electronic components is to be dissipated.

### Claim 9 (depends on 2)

The heat sink as claimed in claim 2, wherein the second face is provided with a fin for increasing an exchange surface of the heat sink with the medium into which the heat generated by the electronic components is to be dissipated.