# US 12,016,133 B2 · Circuit board with a conductive bump mounted on an adhesive layer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,016,133 B2 - Document ID: US12016133B2 - Status: Granted - Kind: B2 - Application number: 17/083,271 - Filed: 2020-10-28 - Published: 2022-03-17 - Granted: 2024-06-18 - Earliest claimed: 2020-09-17 - Assignees: Unimicron Technology Corp. - Applicants: Unimicron Technology Corp. - Inventors: Ming-Hao Wu; Hsuan-Wei Chen - Web page: https://patentgrep.com/patent/US12016133B2 ## CPC - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H05K 3/4046: {using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire} - H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)} - H05K 3/0094: {Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement} - H05K 3/421: {Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence)} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H05K 3/0035: {of blind holes, i.e. having a metal layer at the bottom} - H05K 3/0038: {combined with laser drilling through a metal layer} - H05K 2201/0367: Metallic bump or raised conductor not used as solder bump - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer. ## Claims ### Claim 1 A circuit board, comprising: a first conductive layer; at least one adhesive layer disposed on a surface of the first conductive layer, wherein the at least one adhesive layer is electrically conductive, and a material of the at least one adhesive layer comprises metal particles; at least one conductive bump comprising a top surface and a bottom surface opposite to the top surface, wherein the bottom surface is in contact with the at least one adhesive layer and is adhered on the first conductive layer via the at least one adhesive layer; an insulation layer covering the surface of the first conductive layer and the at least one conductive bump; a second conductive layer disposed on the insulation layer; and at least one conductive column penetrating the second conductive layer and the insulation layer and extending to the top surface of the at least one conductive bump. ### Claim 2 (depends on 1) The circuit board of claim 1, wherein a thickness ratio of the first conductive layer to a total thickness of the first conductive layer, the at least one adhesive layer and the at least one conductive bump is greater than 1:15. ### Claim 3 (depends on 1) The circuit board of claim 1, wherein a total thickness of the first conductive layer, the at least one adhesive layer and the at least one conductive bump ranges from 20 micrometers to 3 millimeters. ### Claim 4 (depends on 1) The circuit board of claim 1, wherein a thickness of the first conductive layer is greater than 3 micrometers. ### Claim 5 (depends on 1) The circuit board of claim 1, wherein a thickness of the at least one adhesive layer is less than 5 micrometers. ### Claim 6 (depends on 1) The circuit board of claim 1, wherein a surface area of the bottom surface of the at least one conductive bump that the at least one adhesive layer is in contact with is not beyond a surface area of the bottom surface of the at least one conductive bump. ### Claim 7 (depends on 1) The circuit board of claim 1, further comprising a plurality of conductive bumps different in sizes, shapes, or both. ### Claim 8 (depends on 1) The circuit board of claim 1, wherein the at least one conductive column has a top portion coplanar with the second conductive layer. ### Claim 9 (depends on 1) The circuit board of claim 1, wherein the at least one conductive column is one conductive column, the at least one conductive bump is one conductive bump, and the conductive column is located on the conductive bump. ### Claim 10 (depends on 1) The circuit board of claim 1, wherein the at least one conductive column is a plurality of conductive columns, the at least one conductive bump is one conductive bump, and the plurality of conductive columns are located on the conductive bump. ### Claim 11 (depends on 1) The circuit board of claim 1, wherein the first conductive layer is a first patterned conductive layer, the second conductive layer is a second patterned conductive layer or combinations thereof. ### Claim 12 A method of manufacturing circuit board, comprising steps of: providing a first conductive layer; providing an adhesive material and at least one conductive bump, wherein the adhesive material is electrically conductive and comprises metal particles; adhering the at least one conductive bump on a surface of the first conductive layer via the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and the at least one conductive bump, comprising: removing a portion of the insulation layer to form at least one recess indented inward; covering and accommodating the at least one conductive bump in the at least one recess; and laminating the insulation layer, the at least one conductive bump and the first conductive layer; and disposing a second conductive layer on the insulation layer. ### Claim 13 (depends on 12) The method of claim 12, wherein the step of adhering the at least one conductive bump on the surface of the first conductive layer via the adhesive material comprises heating the adhesive material to a fluid state and then adhering the at least one conductive bump on the surface of the first conductive layer via the adhesive material. ### Claim 14 (depends on 12) The method of claim 12, further comprising forming at least one conductive column penetrating the second conductive layer and the insulation layer and extending to a top surface of the at least one conductive bump. ### Claim 15 (depends on 14) The method of claim 14, wherein the step of forming the at least one conductive column comprises: removing a portion of the insulation layer and a portion of the second conductive layer to expose the top surface of the at least one conductive bump, thereby forming at least one blind hole; and filling up the at least one blind hole with a conductive material, such that the conductive material is in contact with the second conductive layer to form the at least one conductive column. ### Claim 16 (depends on 12) The method of claim 12, after the step of disposing the second conductive layer on the insulation layer, further comprising patterning the first conductive layer and the second conductive layer.