# US 12,016,129 B2 · Printed circuit board (PCB) and method of making the same

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- Number: US 12,016,129 B2
- Document ID: US12016129B2
- Status: Granted
- Kind: B2
- Application number: 17/837,942
- Filed: 2022-06-10
- Published: 2022-12-15
- Granted: 2024-06-18
- Earliest claimed: 2021-06-11
- Assignees: Zf Cv Systems Europe BV
- Applicants: ZF CV Systems Europe BV
- Inventors: Marcin Calka
- Web page: https://patentgrep.com/patent/US12016129B2

## CPC

- H05K 3/1216: {by screen printing or stencil printing}
- H05K 3/341: Surface mounted components
- H05K 3/108: {by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241)}
- H05K 3/1225: {Screens or stencils; Holders therefor}
- H05K 2203/167: Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

The disclosure is directed to a printed circuit board for mechanical support and electrical connection of electrical or electronic components. The printed circuit board has conductive tracks and contact pads carved away or etched from at least one sheet layer of copper laminated onto a non-conductive substrate and has a label attached to the printed circuit board at an intended position before the assembly process. Soldering defects often occur due to the deposition of excessive amounts of solder paste on the contact pads of components adjacent to the label. To prevent soldering defects caused by incorrect solder paste application quantities by simple and inexpensive means, the printed circuit board provides the intended position of the label as a depression with respect to the surroundings thereof.

## Claims

### Claim 1

A printed circuit board for mechanically supporting and electrically connecting electrical or electronic components, the printed circuit board comprising:
a non-conductive substrate having at least one sheet layer of copper laminated onto said substrate;
said sheet layer of copper having conductive tracks and contact pads carved or etched away therefrom;
a label attached to said printed circuit board at an intended position within predetermined surroundings in advance of an assembly process; and,
said intended position being provided by said printed circuit board as a depression with respect to said predetermined surroundings.

### Claim 2 (depends on 1)

The printed circuit board of claim 1, wherein said intended position of said label is provided as a copper-free area.

### Claim 3 (depends on 1)

The printed circuit board of claim 1, wherein a solder mask is applied at least to said conductive tracks; and, an opening area overlaps said intended position of said label.

### Claim 4 (depends on 2)

The printed circuit board of claim 2, wherein said intended position of said label provides both a copper-free area and a solder mask with an opening area that overlaps said intended position of said label.

### Claim 5

A method of making a printed circuit board for mechanically supporting and electrically connecting electrical or electronic components, the method comprising the steps of:
laminating at least one sheet layer of copper to a non-conductive substrate and carving or etching conductive tracks and contact pads from the sheet layer of copper;
attaching a label to the printed circuit board at an intended position within predetermined surroundings; and,
forming the intended position of the label as a depression with respect to the predetermined surroundings thereof.

### Claim 6 (depends on 5)

The method of claim 5, wherein the intended position of the label is provided as a copper-free area.

### Claim 7 (depends on 5)

The method of claim 5, wherein the depression is provided by a solder mask applied to at least the conductive tracks and including an opening area overlapping the intended position of the label.

### Claim 8 (depends on 6)

The method of claim 6, wherein the intended position of the label is provided by both a copper-free area and a solder mask with an opening area overlapping the intended position of the label.

### Claim 9 (depends on 6)

The method of claim 6, wherein the copper-free area of the intended position of the label is etched from the sheet layer of copper.