# US 12,016,126 B2 · Carrier tape system and components and methods of use > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,016,126 B2 - Document ID: US12016126B2 - Status: Granted - Kind: B2 - Application number: 17/554,621 - Filed: 2021-12-17 - Published: 2022-04-07 - Granted: 2024-06-18 - Earliest claimed: 2018-06-28 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Sung-Sheng Chiu; Pei-Haw Tsao; Tsui-Mei Chen; Shih-Hsing Lin; Li-Huan Chu - Web page: https://patentgrep.com/patent/US12016126B2 ## CPC - H05K 13/021: {Loading or unloading of containers (H05K13/028 takes precedence)} - B65B 9/045: {for single articles, e.g. tablets} - H05K 13/0084: {Containers and magazines for components, e.g. tube-like magazines} - H05K 13/0419: {tape feeders} - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/10: using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] - H10P 72/741: {the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B65B: MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING (bundling and pressing devices for cigars A24C1/44; devices for tensioning and securing binders adapted to be supported by the article or articles to be bound B25B25/00; applying closure members to bottles, jars or similar containers B67B1/00-B67B6/00; concurrent cleaning, filling and closing of bottles B67C7/00; emptying bottles, jars, cans, casks, barrels or similar containers B67C9/00) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described. ## Claims ### Claim 1 A carrier tape system for a semiconductor device, the carrier tape system comprising: a carrier tape including a plurality of pockets, each pocket including an opening through which a semiconductor device passes when the semiconductor device is placed in the pocket, the semiconductor device having a width dimension; and a cover tape including a cover tape base material and an adhesive layer on the cover tape base material, the adhesive layer including a plurality of adhesion areas consisting of adhesive on the cover tape base material and a plurality of discontinuous non-adhesion areas along a length of the cover tape base material, the discontinuous non-adhesion layers including adhesive on the cover tape base material and a material that is not sticky over the adhesive on the cover tape base material, wherein the plurality of adhesion areas encompass respective ones of the plurality of non-adhesion areas and wherein each of the plurality of non-adhesion areas are spaced from each other along the length of the cover tape base material and correspond to a portion of the cover tape that covers an opening of a pocket of the plurality of pockets, each of the plurality of non-adhesion areas facing a respective one of the plurality of pockets and each of the plurality of discontinuous non-adhesion areas has a width dimension or a diameter that is less than the width dimension of the semiconductor device. ### Claim 2 (depends on 1) The carrier tape system of claim 1, wherein the opening has a size and shape and each of the plurality of non-adhesion areas of the cover tape has a shape that is substantially the same as the shape of the opening of the respective pocket. ### Claim 3 (depends on 1) The carrier tape system of claim 1, wherein the opening has a size and shape and each of the plurality of non-adhesion areas has a shape that is substantially the same as the shape of the opening of the respective pocket and a size that is less than the size of the opening of the respective pocket. ### Claim 4 (depends on 1) The carrier tape system of claim 1, wherein the opening has a length and each of the plurality of non-adhesion areas has a length that is less than the length of the opening of the respective pocket. ### Claim 5 (depends on 1) The carrier tape system of claim 1, wherein the opening has a width and each of the plurality of non-adhesion areas has a width that is less than the width of the opening of the respective pocket. ### Claim 6 (depends on 1) The carrier tape system of claim 1, wherein the material that is not sticky is a polyethylene terephthalate or a crosslinkable silicone. ### Claim 7 A carrier tape system for a semiconductor device, the carrier tape system comprising: a carrier tape including a plurality of pockets, each pocket including an opening through which a semiconductor device passes when the semiconductor device is placed in the pocket, the semiconductor device having a width dimension; and a cover tape including a cover tape base material and an adhesive layer on the cover tape base material, the adhesive layer including a plurality of adhesion areas consisting of adhesive on the cover tape base material and a plurality of discontinuous non-adhesion areas along a length of the cover tape base material, the discontinuous non-adhesion areas including adhesive on the cover tape base material and a material overlying the adhesive on the cover tape base material that inhibits an adhesive from adhering to a semiconductor device when it is in the pocket, wherein the plurality of adhesion areas encompass respective ones of the plurality of non-adhesion areas-, are spaced from each other along the length of the cover tape base material and correspond to portions of the cover tape that cover respective openings of the plurality of pockets, each of the plurality of non-adhesion areas facing a respective one of the plurality of pockets and each of the plurality of discontinuous non-adhesion areas has a width dimension or a diameter that is less than the width dimension of the semiconductor device. ### Claim 8 (depends on 7) The carrier tape system of claim 7, wherein the opening has a shape and each of the plurality of non-adhesion areas of the cover tape has a shape that is substantially the same as the shape of the opening of the respective pocket. ### Claim 9 (depends on 7) The carrier tape system of claim 7, wherein the opening has a size and each of the plurality of non-adhesion areas has a size that is smaller than the size of the opening of the respective pocket. ### Claim 10 (depends on 7) The carrier tape system of claim 7, wherein the opening has a length and each of the plurality of non-adhesion areas has a length that is less than the length of the opening of the respective pocket. ### Claim 11 (depends on 7) The carrier tape system of claim 7, wherein the opening has a width and each of the plurality of non-adhesion areas has a width that is less than the width of the opening of the respective pocket. ### Claim 12 (depends on 7) The carrier tape system of claim 7, wherein the material that inhibits an adhesive from adhering to a semiconductor device when it is in the pocket is a polyethylene terephthalate or a crosslinkable silicone. ### Claim 13 (depends on 7) The carrier tape system of claim 7, wherein the material that inhibits an adhesive from adhering to a semiconductor device when it is in the pocket is polyethylene terephthalate. ### Claim 14 (depends on 7) The carrier tape system of claim 7, wherein the semiconductor device has a width dimension and each of the plurality of non-adhesion areas of the cover tape has a width dimension or a diameter that is less than the width dimension of the semiconductor device. ### Claim 15 A carrier tape system for a semiconductor device, the carrier tape system comprising: a carrier tape including a plurality of pockets, each pocket including an opening through which a semiconductor device passes when the semiconductor device is placed in the pocket, the semiconductor device having a width dimension and each opening having a round shape and including a diameter dimension; and a cover tape including a cover tape base material and an adhesive layer on the cover tape base material, the adhesive layer including a plurality of adhesion areas consisting of adhesive on the cover tape base material and a plurality of discontinuous non-adhesion areas along a length of the cover tape base material, the discontinuous non-adhesion areas including either (1) portions of the adhesive layer covered by a material that inhibits the adhesive layer from adhering to a semiconductor device when it is in the pocket or (2) adhesive on the cover tape base material and a material that is not sticky over the adhesive on the cover tape base material, wherein the plurality of adhesion areas encompass respective ones of the plurality of non-adhesion areas and wherein each of the plurality of non-adhesion areas are round, have a diameter dimension that is less than the width dimension of the semiconductor device, are spaced from each other along the length of the cover tape base material and corresponds to portions of the cover tape that cover a respective opening of a pocket of the plurality of pockets, each of the plurality of non-adhesion areas facing a respective one of the plurality of pockets. ### Claim 16 (depends on 15) The carrier tape system of claim 15, wherein the material that inhibits an adhesive from adhering to a semiconductor device when it is in the pocket is a polyethylene terephthalate or a crosslinkable silicone. ### Claim 17 (depends on 15) The carrier tape system of claim 15, wherein the material that inhibits an adhesive from adhering to a semiconductor device when it is in the pocket is polyethylene terephthalate. ### Claim 18 (depends on 15) The carrier tape system of claim 15, wherein corners of the semiconductor die are overlapped by portions of the adhesion areas. ### Claim 19 (depends on 15) The carrier tape system of claim 15, wherein the material that inhibits an adhesive from adhering to a semiconductor device when it is in the pocket is a polyethylene terephthalate or a crosslinkable silicone. ### Claim 20 (depends on 15) The carrier tape system of claim 15, wherein the material that inhibits an adhesive from adhering to a semiconductor device when it is in the pocket is polyethylene terephthalate.