# US 12,016,119 B2 · Method for manufacturing multilayer printed circuit board

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,016,119 B2
- Document ID: US12016119B2
- Status: Granted
- Kind: B2
- Application number: 17/542,706
- Filed: 2021-12-06
- Published: 2022-03-24
- Granted: 2024-06-18
- Earliest claimed: 2020-04-22
- Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.; Avary Holding (Shenzhen) Co., Limited.
- Applicants: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.; Avary Holding (Shenzhen) Co., Limited.
- Inventors: Cheng-Jia Li; Mei Yang
- Web page: https://patentgrep.com/patent/US12016119B2

## CPC

- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 1/113: {Via provided in pad; Pad over filled via}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 3/02: in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K 3/4608: {comprising an electrically conductive base or core}
- H05K 3/4673: {Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28)}
- H05K 3/002: {by liquid chemical etching}
- H05K 3/108: {by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241)}
- H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
- H05K 2201/0352: Differences between the conductors of different layers of a multilayer
- H05K 2201/09381: Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
- H05K 2201/09518: Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
- H05K 2201/0959: Plated through-holes or plated blind vias filled with insulating material
- Y10T 29/49126: Assembling bases
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method for manufacturing such multilayer printed circuit board includes providing a metal laminated structure including a first type metal layer and a second type metal layer, pressing a patterned dry film layer and a protective film layer on two surfaces of the metal laminated structure, the dry film layer exposing the second type metal layer; etching the second type metal layer to form a first conductive circuit layer; etching a first type metal layer to form a second conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer defining an inner circuit laminated structure; removing the dry film layer; and forming a first adding-layer circuit base board and a second adding-layer circuit base board on two surfaces of the inner laminated structure.

## Claims

### Claim 1

A method for manufacturing a multilayer printed circuit board, comprising:
providing a metal laminated structure, wherein the metal laminated structure comprises at least one first type metal layer and at least one second type metal layer that are alternately stacked together; and the first type metal layer and the second type metal layer both have different etching ability;
pressing a patterned dry film layer on one surface of the metal laminated structure, and pressing a protective film layer on the other surface of the metal laminated structure; and wherein the second type metal layer is exposed from the dry film layer;
etching the second type metal layer exposed from the dry film layer by a first type etching solution to form a plurality of first trenches, thereby forming a first conductive circuit layer;
etching the first type metal layer exposed from the first trenches by a second type etching solution to form a plurality of second trenches, thereby forming a second conductive circuit layer; and wherein the second conductive circuit layer and the first conductive circuit layer define an inner circuit laminated structure;
removing the dry film layer; and
forming a first adding-layer circuit base board and a second adding-layer circuit base board on two surfaces of the inner circuit laminated structure, electrically connecting the first adding-layer circuit base board to the second adding-layer circuit base board, electrically connecting the first adding-layer circuit base board to the inner circuit laminated structure, and electrically connecting the second adding-layer circuit base board to the inner circuit laminated structure.

### Claim 2 (depends on 1)

The method of claim 1, wherein the inner circuit laminated structure comprises a plurality of inner-layer circuits, trenches are defined between two adjacent inner-layer circuits; before “forming a first adding-layer circuit base board and a second adding-layer circuit base board on two surfaces of the inner circuit laminated structure”, the method further comprises:
pressing a first adhesive layer on the first conductive circuit layer, and removing the protective film layer; wherein a portion of the first adhesive layer infills in the first trenches and the second trenches;
etching the first type metal layer where the protective film layer formed on by a second type etching solution to form a plurality of third trenches, thereby forming a third conductive circuit layer;
etching the second type metal layer exposed from the third trenches by a first type etching solution to form a plurality of fourth trenches, thereby forming a fourth conductive circuit layer; and
pressing a second adhesive layer on the third conductive circuit layer, wherein a portion of the second adhesive layer infills in the third trenches and the fourth trenches.

### Claim 3 (depends on 2)

The method of claim 2, wherein the metal laminated structure comprises a first metal layer, a second metal layer, a third metal layer, and a fourth metal layer; the second metal layer, the first metal layer, the third metal layer, and the fourth metal layer are alternately stacked together; the first metal layer and the fourth metal layer belong to the first type metal layer; and the second metal layer and the third metal layer belong to the second type metal layer; the dry film layer is pressed on the second metal layer; and the protective film layer is pressed on the fourth metal layer.

### Claim 4 (depends on 3)

The method of claim 3, wherein the first trenches is defined in the first conductive circuit layer, the second trenches is defined in the second conductive circuit layer, the third trenches is defined in the third conductive circuit layer, and the fourth trenches is defined in the fourth conductive circuit layer.

### Claim 5 (depends on 4)

The method of claim 4, wherein the first trenches, the second trenches, the third trenches, and the fourth trenches have a positive trapezoidal shape or an inverted trapezoidal shape or a funnel shape formed by a positive trapezoidal shape and an inverted trapezoidal shape.

### Claim 6 (depends on 1)

The method of claim 1, wherein the first adding-layer circuit base board is electrically connected to the second adding-layer circuit base board by at least one conductive through hole; the first adding-layer circuit base board is electrically connected to the inner circuit laminated structure by at least one first conductive blind hole; and the second adding-layer circuit base board is electrically connected to the inner circuit laminated structure by at least one second conductive blind hole.

### Claim 7 (depends on 6)

The method of claim 6, the method further comprising:
pressing a third adhesive layer on the first adding-layer circuit base board;
pressing a fourth adhesive layer on the second adding-layer circuit base board; and wherein a portion of the third adhesive layer and a portion of the fourth adhesive layer infill in the at least one conductive through hole;
forming a third adding-layer circuit base board on the third adhesive layer, wherein the third adding-layer circuit base board is electrically connected to the first adding-layer circuit base board; and
forming a fourth adding-layer circuit base board on the fourth adhesive layer, wherein the fourth adding-layer circuit base board is electrically connected to the second adding-layer circuit base board.

### Claim 8 (depends on 1)

The method of claim 1, wherein a material of the first type metal layer is copper, and a material of the second type metal layer is silver.

### Claim 9 (depends on 1)

The method of claim 1, wherein each of the first type circuit trench and the second type circuit trench has an inverted trapezoidal shape.