# US 12,016,112 B2 · Electronic module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,016,112 B2 - Document ID: US12016112B2 - Status: Granted - Kind: B2 - Application number: 17/204,236 - Filed: 2021-03-17 - Published: 2021-07-01 - Granted: 2024-06-18 - Earliest claimed: 2018-10-05 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yoshihito Otsubo; Naoya Murakita - Web page: https://patentgrep.com/patent/US12016112B2 ## CPC - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips} - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 99/00: Subject matter not provided for in other groups of this subclass - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 9/0084: {comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition} - H05K 2201/0715: provided by an outer layer of PCB - H05K 2201/086: for inductive purposes, e.g. printed inductor with ferrite core - H05K 2201/09972: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently - H05K 2201/10242: Metallic cylinders - H05K 2201/10287: Metal wires as connectors or conductors - H05K 2201/10371: Shields or metal cases - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A module is provided with a substrate including a principal surface, a plurality of electronic components arranged on the principal surface, a sealing resin covering the principal surface and the plurality of electronic components, a ground electrode arranged on the principal surface or inside the substrate, a conductive layer covering the sealing resin and electrically connected to the ground electrode, and a magnetic member. The magnetic member includes a magnetic plate member arranged so as to cover at least a part of the sealing resin and a magnetic wall member arranged in a wall shape between any of the plurality of electronic components. The module is further provided with a metal pin or a metal wire provided along the magnetic wall member and connected to the ground electrode. ## Claims ### Claim 1 A module comprising: a substrate including a principal surface; a plurality of electronic components mounted on the principal surface; a sealing resin covering the principal surface and the plurality of electronic components; a ground electrode on the principal surface or inside the substrate; a conductive layer covering the sealing resin and electrically connected to the ground electrode; and a magnetic member, wherein the magnetic member includes: a magnetic plate member covering at least a part of the sealing resin and the plurality of electronic components mounted on the principal surface, a magnetic wall member in a wall shape disposed between any of the plurality of electronic components, the magnetic wall member attached to the magnetic plate at a position located between two ends of the magnetic plate, and a metal pin or a metal wire along the magnetic wall member, the metal pin or the metal wire being connected to the ground electrode. ### Claim 2 (depends on 1) The module according to claim 1, wherein the magnetic plate member is interposed between the conductive layer and the sealing resin. ### Claim 3 (depends on 2) The module according to claim 2, wherein the magnetic wall member surrounds at least one of the plurality of electronic components. ### Claim 4 (depends on 2) The module according to claim 2, wherein the module comprises the metal pin, the ground electrode is on the principal surface, and a portion of the conductive layer covering an upper surface of the sealing resin is connected to the ground electrode by the metal pin. ### Claim 5 (depends on 2) The module according to claim 2, wherein the module comprises a plurality of the metal wires, and both ends of each of the plurality of the metal wires are electrically connected to the principal surface and are grounded. ### Claim 6 (depends on 2) The module according to claim 2, wherein the magnetic member contains: an alloy comprising an Fe—Co-based alloy, or an Fe—Ni-based alloy, or a combination of the Fe—Co-based alloy and the Fe—Ni-based alloy, or a ferrite material comprising NiZn, or MnZn, or a combination of NiZn and MnZn, or permalloy plating. ### Claim 7 (depends on 1) The module according to claim 1, wherein the conductive layer is interposed between the magnetic plate member and the sealing resin. ### Claim 8 (depends on 7) The module according to claim 7, wherein the magnetic wall member surrounds at least one of the plurality of electronic components. ### Claim 9 (depends on 7) The module according to claim 7, wherein the module comprises the metal pin, the ground electrode is on the principal surface, and a portion of the conductive layer covering an upper surface of the sealing resin is connected to the ground electrode by the metal pin. ### Claim 10 (depends on 7) The module according to claim 7, wherein the module comprises a plurality of the metal wires, and both ends of each of the plurality of the metal wires are electrically connected to the principal surface and are grounded. ### Claim 11 (depends on 7) The module according to claim 7, wherein the magnetic member contains: an alloy comprising an Fe—Co-based alloy, or an Fe—Ni-based alloy, or a combination of the Fe—Co-based alloy and the Fe—Ni-based alloy, or a ferrite material comprising NiZn, or MnZn, or a combination of NiZn and MnZn, or permalloy plating. ### Claim 12 (depends on 1) The module according to claim 1, wherein the magnetic wall member surrounds at least one of the plurality of electronic components. ### Claim 13 (depends on 12) The module according to claim 12, wherein the module comprises the metal pin, the ground electrode is on the principal surface, and a portion of the conductive layer covering an upper surface of the sealing resin is connected to the ground electrode by the metal pin. ### Claim 14 (depends on 12) The module according to claim 12, wherein the module comprises a plurality of the metal wires, and both ends of each of the plurality of the metal wires are electrically connected to the principal surface and are grounded. ### Claim 15 (depends on 12) The module according to claim 12, wherein the magnetic member contains: an alloy comprising an Fe—Co-based alloy, or an Fe—Ni-based alloy, or a combination of the Fe—Co-based alloy and the Fe—Ni-based alloy, or a ferrite material comprising NiZn, or MnZn, or a combination of NiZn and MnZn, or permalloy plating. ### Claim 16 (depends on 1) The module according to claim 1, wherein the module comprises the metal pin, the ground electrode is on the principal surface, and a portion of the conductive layer covering an upper surface of the sealing resin is connected to the ground electrode by the metal pin. ### Claim 17 (depends on 16) The module according to claim 16, wherein the magnetic member contains: an alloy comprising an Fe—Co-based alloy, or an Fe—Ni-based alloy, or a combination of the Fe—Co-based alloy and the Fe—Ni-based alloy, or a ferrite material comprising NiZn, or MnZn, or a combination of NiZn and MnZn, or permalloy plating. ### Claim 18 (depends on 1) The module according to claim 1, wherein the module comprises a plurality of the metal wires, and both ends of each of the plurality of the metal wires are electrically connected to the principal surface and are grounded. ### Claim 19 (depends on 1) The module according to claim 1, wherein the magnetic member contains: an alloy comprising an Fe—Co-based alloy, or an Fe—Ni-based alloy, or a combination of the Fe—Co-based alloy and the Fe—Ni-based alloy, or a ferrite material comprising NiZn, or MnZn, or a combination of NiZn and MnZn, or permalloy plating. ### Claim 20 (depends on 1) The module according to claim 1, wherein the substrate further includes a second principal surface as a surface opposite to the principal surface, the module further comprising: a second electronic component on the second principal surface; a second sealing resin covering the second principal surface and the second electronic component; and an external terminal on the second principal surface.