# US 12,016,110 B2 · Electronic device with active heat transfer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,016,110 B2 - Document ID: US12016110B2 - Status: Granted - Kind: B2 - Application number: 17/588,817 - Filed: 2022-01-31 - Published: 2023-08-03 - Granted: 2024-06-18 - Earliest claimed: 2022-01-31 - Assignees: Microsoft Technology Licensing, LLC - Applicants: Microsoft Technology Licensing, LLC - Inventors: Kang-Ming Chuang; Yi-Ming Kao - Web page: https://patentgrep.com/patent/US12016110B2 ## CPC - G06F 1/20: Cooling means - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - G06F 1/181: {Enclosures (for portable computers G06F1/1613)} - G06F 1/182: {with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]} - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device is provided that includes a PCB and a cooling system adapted to pull heat away from a first side of the PCB and dissipate the heat through a back surface of the electronic device. The cooling system includes a heat pipe that wraps around PCB. The cooling system further includes an active heat transfer device positioned adjacent to a second portion of the heat pipe, the active heat transfer device being adapted to absorb heat through a first surface and release the heat through a second surface of the active heat transfer device. The cooling system further includes a first passive heat transfer element that forms the back surface of the electronic device and that conducts the heat received from the active heat transfer device out of the electronic device. ## Claims ### Claim 1 An electronic device, comprising: a printed circuit board (PCB) having a first side facing a front surface of the electronic device and a second side opposite the first side, the second side facing a back surface of the electronic device; a cooling system adapted to pull heat away from the first side of the PCB and dissipate the heat through the back surface of the electronic device, the cooling system including: a heat pipe that wraps around three sides of the PCB and includes a first portion on the first side of the PCB and a second portion on the second side of the PCB; an active heat transfer device positioned adjacent to the second portion of the heat pipe, the active heat transfer device having a first surface facing the heat pipe and a second surface opposite the first surface and facing the back surface of the electronic device, the active heat transfer device being adapted to absorb the heat through the first surface and release the heat through the second surface; a first passive heat transfer element that forms the back surface of the electronic device and that conducts the heat received from the second surface of the active heat transfer device out of the electronic device; and a plate on the second side of the PCB, wherein the plate at least partially defines the back surface of the electronic device and wherein the first passive heat transfer element is at least partially embedded within or coupled to the plate. ### Claim 2 (depends on 1) The electronic device of claim 1, further comprising: a case at least partially enclosing the first side of the PCB and the heat pipe, wherein the plate is coupled to the case. ### Claim 3 (depends on 2) The electronic device of claim 2, wherein: the plate has an interior surface facing the PCB and an exterior surface substantially opposite the interior surface, and a portion of the interior surface of the plate thermally interfaces with the second surface of the active heat transfer device. ### Claim 4 (depends on 3) The electronic device of claim 3, wherein the portion of the interior surface includes a recess and the active heat transfer device is arranged at least partially within the recess. ### Claim 5 (depends on 3) The electronic device of claim 3, wherein the plate includes mount coupling elements in the exterior surface of the plate and positioned about a back surface hot spot that is located on the exterior surface of the plate opposite the portion of the interior surface of the plate that thermally interfaces with the second surface of the active heat transfer device. ### Claim 6 (depends on 5) The electronic device of claim 5, further comprising: a mount coupled to the exterior surface of the plate covering the back surface hot spot. ### Claim 7 (depends on 2) The electronic device of claim 2, wherein the case includes a second passive heat transfer element on a front surface of the case that is adjacent to the first side of the PCB. ### Claim 8 (depends on 7) The electronic device of claim 7, wherein the first passive heat transfer element and the second passive heat transfer element are heat sinks. ### Claim 9 (depends on 7) The electronic device of claim 7, wherein the second passive heat transfer element is larger than the first passive heat transfer element. ### Claim 10 (depends on 1) The electronic device of claim 1, further comprising a processor and memory, the processor operable to execute instructions stored on the memory to modify electrical energy supplied to the active heat transfer device responsive to satisfaction of a thermal control condition, the thermal control condition including: a temperature difference between a temperature of a first position in an interior of the electronic device and a temperature of a second position outside of the electronic device exceeding a first threshold value; or an operating energy that includes energy used by the PCB exceeding a second threshold value. ### Claim 11 (depends on 1) The electronic device of claim 1, wherein the PCB is arranged such that more of the heat is generated on the first side than the second side during operation. ### Claim 12 (depends on 1) The electronic device of claim 1, wherein the active heat transfer device includes a thermoelectric cooler. ### Claim 13 A method of transferring heat away from a front surface of an electronic device and dissipating the heat through a back surface of the electronic device opposite the front surface, the method comprising: receiving the heat generated by a heat source at a first portion of a heat pipe on a first side of the heat source, the heat pipe wrapping partially around the heat source and including a second portion on a second side of the heat source opposite the first side; transferring the heat from the second portion of the heat pipe to a first surface of an active heat transfer device; conducting the heat through a second surface of the active heat transfer device opposite the first surface; and dissipating, with a first passive heat transfer element coupled to or embedded within a plate that at least partially defines a back surface of the electronic device, the heat conducted through the second surface of the active heat transfer device through the back surface of the electronic device. ### Claim 14 (depends on 13) The method of claim 13, further comprising: coupling a plate that includes the first passive heat transfer element to a mounting element, the mounting element covering a back surface hot spot on an exterior surface of the plate opposite a portion of an interior surface of the plate with which the second opposite surface of the active heat transfer device thermally interfaces. ### Claim 15 (depends on 13) The method of claim 13, further comprising: modifying, by a processor, energy supplied to the active heat transfer device responsive to satisfaction of a thermal control condition, the thermal control condition including: a temperature difference between a temperature of a first position in an interior of the electronic device and a temperature of a second position outside of the electronic device exceeding a first threshold value; or an operating energy that includes energy used by the heat source exceeding a second threshold value. ### Claim 16 (depends on 13) The method of claim 13, further comprising: dissipating, with a second passive heat transfer element adjacent to the first side of the heat source, further heat generated by the heat source through a front surface of the electronic device. ### Claim 17 A cooling system, comprising: a heat pipe adapted to extend along three sides of a heat source, the heat pipe including a first portion positioned on a first side of the heat source and a second portion adapted to be positioned on a second side of the heat source opposite the first side, the first portion of the heat pipe adapted to absorb heat from the first side of the heat source; an active heat transfer device positioned adjacent to the second portion of the heat pipe, the active heat transfer device being adapted to absorb the heat through a first surface facing the heat pipe and release the heat through a second surface opposite the first surface; and a first passive heat transfer element adjacent to the second surface of the active heat transfer device, the first passive heat element being coupled to or embedded within a plate that dissipates the heat and that at least partially defines a back surface of an electronic device. ### Claim 18 (depends on 17) The cooling system of claim 17, wherein the active heat transfer device includes a thermoelectric cooler. ### Claim 19 (depends on 17) The cooling system of claim 17, further comprising: a second passive heat transfer element adjacent to the first side of the heat source. ### Claim 20 (depends on 19) The cooling system of claim 19, wherein the second passive heat transfer element is larger than the first passive heat transfer element.