Temperature sensing induction heating tool

An induction heating and bonding apparatus configured to bond a membrane to an attachment plate beneath the membrane, comprising:

• an induction coil of the induction heating and bonding apparatus being arranged on an induction head of the induction heating and bonding apparatus, said induction head positionable above the membrane adjacent the attachment plate;
• said induction head comprising an attachment point and containing said induction coil, wherein the induction head surrounds at least an outer perimeter of the induction coil;
• a power supply of the induction heating and bonding apparatus being connected to deliver power to a tank circuit of the induction heating and bonding apparatus, said power supply having a pre-determined constant output voltage or constant output current, said tank circuit generating an oscillating magnetic field emanating from said induction coil when power is delivered from the power supply, said oscillating magnetic field inducing eddy currents in the attachment plate magnetically coupled to the induction coil to heat the attachment plate and bond the attachment plate to a portion of the membrane;
• and
• a control circuit of the induction heating and bonding apparatus being configured to measure an output voltage or output current of the power supply that is not held constant, said control circuit correlating changes in measured output voltage or measured output current during heating of the attachment plate through the membrane to a temperature of the attachment plate.

An induction heating and bonding apparatus configured to activate an adhesive arranged on a workpiece so as to bond the workpiece to a membrane extending over the workpiece, comprising:

• an induction coil of the induction heating and bonding apparatus being arranged on an induction head of the induction heating and bonding apparatus, said induction head positionable on top of the membrane adjacent the workpiece;
• said induction head comprising an attachment point and containing said induction coil, wherein the induction head surrounds at least an outer perimeter of the induction coil;
• a power supply of the induction heating and bonding apparatus being connected to deliver power to a tank circuit of the induction heating and bonding apparatus, said power supply having a pre-determined constant output voltage or constant output current, said tank circuit generating an oscillating magnetic field emanating from said induction coil when power is delivered from the power supply, said oscillating magnetic field inducing eddy currents in the workpiece magnetically coupled to the induction coil to heat the workpiece through the membrane and activate the adhesive;
• and
• a control circuit of the induction heating and bonding apparatus being configured to monitor changes in power consumed by the tank circuit during heating of the workpiece.