# US 12,016,092 B2 · Gas distribution ceramic heater for deposition chamber > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,016,092 B2 - Document ID: US12016092B2 - Status: Granted - Kind: B2 - Application number: 17/106,735 - Filed: 2020-11-30 - Published: 2021-06-10 - Granted: 2024-06-18 - Earliest claimed: 2019-12-05 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Pingyan Lei; Dien-Yeh Wu; Jallepally Ravi; Manjunatha Koppa; Ambarish Toorihal; Sandesh Yadamane; Vinod Konda Purathe; Xiaoxiong Yuan - Web page: https://patentgrep.com/patent/US12016092B2 ## CPC - H05B 3/48: heating conductor embedded in insulating material - C23C 14/541: {Heating or cooling of the substrates} - C23C 16/45565: {Shower nozzles} - C23C 16/4557: {Heated nozzles} - C23C 16/4586: {Elements in the interior of the support, e.g. electrodes, heating or cooling devices} - C23C 16/509: using internal electrodes - H05B 3/141: {Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds} - H05B 6/62: Apparatus for specific applications - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) ## Abstract Embodiments of a lid heater for a deposition chamber are provided herein. In some embodiments, a lid heater for a deposition chamber includes a ceramic heater body having a first side opposite a second side, wherein the ceramic heater body includes a first plurality of gas channels extending from one or more first gas inlets on the first side, wherein each of the one or more first gas inlets extend to a plurality of first gas outlets on the second side; a heating element embedded in the ceramic heater body; and an RF electrode embedded in the ceramic heater body proximate the second side, wherein the first plurality of gas channels extend through the RF electrode. ## Claims ### Claim 1 A lid heater for a deposition chamber, comprising: a ceramic heater body having a first side opposite a second side, wherein the ceramic heater body includes a first plurality of gas channels extending from one or more first gas inlets on the first side, wherein each of the one or more first gas inlets extends to a plurality of first gas outlets on the second side; a heating element embedded in the ceramic heater body; and an RF electrode embedded in the ceramic heater body proximate the second side such that the RF electrode is not exposed to a process volume facing surface of the lid heater, wherein the first plurality of gas channels extend through the RF electrode. ### Claim 2 (depends on 1) The lid heater of claim 1, wherein the first plurality of gas channels includes a first passageway extending substantially vertically from the one or more first gas inlet towards the second side, a plurality of second passageways extending radially outward from the first passageway, and a plurality of third passageways extending from each of the second passageways to the plurality of first gas outlets. ### Claim 3 (depends on 1) The lid heater of claim 1, wherein the RF electrode comprises a conductive mesh. ### Claim 4 (depends on 1) The lid heater of claim 1, wherein the RF electrode is disposed about 0.5 mm to about 1.5 mm from the second side. ### Claim 5 (depends on 1) The lid heater of claim 1, wherein the first plurality of gas channels have a circular cross-section. ### Claim 6 (depends on 1) The lid heater of claim 1, wherein at least one of: the first plurality of gas channels have a diameter of about 2.0 mm to about 12.0 mm, or the first gas outlets have a diameter of about 0.02 inches to about 0.10 inches. ### Claim 7 (depends on 1) The lid heater of claim 1, wherein the ceramic heater body includes internal conduits and the plurality of first gas outlets fluidly coupled to the internal conduits via a plurality of passageways. ### Claim 8 (depends on 1) The lid heater of claim 1, further comprising a second plurality of gas channels extending from a second gas inlet on the first side to a plurality of second gas outlets on the second side. ### Claim 9 (depends on 8) The lid heater of claim 8, wherein the plurality of second gas outlets are disposed radially inward of the plurality of first gas outlets. ### Claim 10 A substrate processing apparatus, comprising: a lid heater having a ceramic heater body made entirely of a ceramic material and having a first side opposite a second side, wherein the ceramic heater body includes a first plurality of gas channels extending from one or more first gas inlets on the first side to a plurality of first gas outlets on the second side, wherein the first plurality of gas channels includes a first passageway extending substantially vertically from each of the one or more first gas inlets towards the second side, a plurality of second passageways extending horizontally outward from each first passageway, and a plurality of third passageways extending from each of the plurality of second passageways towards the plurality of first gas outlets; an RF electrode embedded in the ceramic heater body proximate the second side, wherein the first plurality of gas channels extend through the RF electrode; and a heating element embedded in the ceramic heater body. ### Claim 11 (depends on 10) The apparatus of claim 10, wherein the RF electrode is a conductive plate with openings or a conductive mesh. ### Claim 12 (depends on 11) The apparatus of claim 11, wherein the heating element is disposed between the RF electrode and the first side. ### Claim 13 (depends on 10) The apparatus of claim 10, wherein the first plurality of gas channels include a plurality of fourth passageways that extend horizontally outward from the each of the plurality of third passageways, a plurality of fifth passageways that extend substantially vertically from each of the plurality of fourth passageways, a plurality of sixth passageways that extend horizontally outward from each of the plurality of fifth passageways, and a plurality of seventh passageways that extend from each of the sixth passageways to the plurality of first gas outlets. ### Claim 14 (depends on 10) The apparatus of claim 10, wherein the first plurality of gas channels have a rectangular cross-section. ### Claim 15 A deposition chamber, comprising: a process chamber having a chamber lid and defining a processing volume therein; a support pedestal disposed in the processing volume to support a substrate; a lid heater coupled to the chamber lid, wherein the lid heater includes a ceramic heater body coupled to a shaft and extending radially outward from the shaft, the ceramic heater body having a first side opposite a second side and a heating element embedded therein and disposed between the shaft and the second side, wherein the lid heater includes a first gas flow line extending through the shaft and a first plurality of gas channels extending from the first gas flow line to a plurality of first gas outlets on the second side; and an RF electrode embedded in the ceramic heater body proximate the second side, wherein the first plurality of gas channels extend through the RF electrode. ### Claim 16 (depends on 15) The deposition chamber of claim 15, further comprising a showerhead disposed between and spaced from the support pedestal and the lid heater. ### Claim 17 (depends on 16) The deposition chamber of claim 16, wherein a second gas flow line is coupled to the showerhead. ### Claim 18 (depends on 15) The deposition chamber of claim 15, further comprising a second plurality of gas channels extending from a second gas inlet on the first side to a plurality of second gas outlets on the second side. ### Claim 19 (depends on 15) The deposition chamber of claim 15, wherein the ceramic heater body includes internal conduits disposed between the RF electrode and the heating element, and wherein the internal conduits include an annular groove. ### Claim 20 (depends on 19) The deposition chamber of claim 19, wherein the internal conduits are arranged in an orthogonal pattern about the annular groove.