# US 12,015,433 B2 · Radio frequency module and communication device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,015,433 B2 - Document ID: US12015433B2 - Status: Granted - Kind: B2 - Application number: 18/309,834 - Filed: 2023-05-01 - Published: 2023-08-24 - Granted: 2024-06-18 - Earliest claimed: 2018-06-11 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Takanori Uejima - Web page: https://patentgrep.com/patent/US12015433B2 ## CPC - H04B 1/0057: {using diplexing or multiplexing filters for selecting the desired band} - H04B 1/0475: {with means for limiting noise, interference or distortion (H04B1/0483 takes precedence)} - H03H 7/46: Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source - H03H 9/70: Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source - H03H 9/72: Networks using surface acoustic waves - H04B 1/006: {using switches for selecting the desired band (H04B1/0057 takes precedence)} - H04B 1/04: Circuits - H04B 1/0458: {Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages (matching circuits in general H03H)} - H04B 1/10: Means associated with receiver for limiting or suppressing noise or interference - H04B 1/40: Circuits - H04B 1/44: Transmit/receive switching - H04W 52/243: {taking into account interferences} - H04W 52/52: using AGC [Automatic Gain Control] circuits or amplifiers - H04W 88/06: adapted for operation in multiple networks {or having at least two operational modes}, e.g. multi-mode terminals - H04B 2001/0408: {with power amplifiers} - H04B 2001/0416: {having gain or transmission power control} - H04B: TRANSMISSION - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H04W: WIRELESS COMMUNICATION NETWORKS (broadcast communication H04H; communication systems using wireless links for non-selective communication, e.g. wireless extensions H04M1/72) ## Abstract A radio frequency module includes a module board, a transmission power amplifier, a first inductance element mounted on a first principal surface and connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element mounted on a first principal surface connected to an input terminal of the reception low-noise amplifier. In a plan view of the module board, a conductive member mounted on the first principal surface is disposed between the first inductance element and the second inductance element. ## Claims ### Claim 1 A radio frequency module, comprising: a common terminal; a first transmission power amplifier; a first transmission filter connected between the common terminal and the first transmission power amplifier, and configured to pass a radio frequency transmission signal of a first band; a second transmission filter connected between the common terminal and the first transmission power amplifier, and configured to pass a radio frequency transmission signal of a second band which is different from the first band; a first switch configured to switch a connection between the first transmission power amplifier and the first transmission filter and a connection between the first transmission power amplifier and the second transmission filter; a first inductor connected between the first switch and the first transmission power amplifier; a first reception low-noise amplifier; a first reception filter connected between the common terminal and the first reception low-noise amplifier, and configured to pass a radio frequency reception signal of the first band; a second switch configured to switch a connection between the common terminal and the first transmission filter, a connection between the common terminal and the second transmission filter, and a connection between the common terminal and the first reception filter, and to connect simultaneously the connection between the common terminal and the first transmission filter and the connection between the common terminal and the first reception filter; a second inductor connected between the first reception low-noise amplifier and the first reception filter; a module board including a first principal surface and a second principal surface on opposite side of the first principal surface, wherein the first transmission power amplifier, the first transmission filter, the second transmission filter, the first reception filter, the first inductor and the second inductor are mounted on the first principal surface, the first switch, the second switch and the first reception low-noise amplifier are mounted on the second principal surface, and the first transmission filter, the second transmission filter, or the first reception filter is mounted between the first inductor and the second inductor in a plan view from a thickness direction of the module board. ### Claim 2 (depends on 1) The radio frequency module according to claim 1, wherein in the plan view from a thickness direction of the module board, the first principal surface includes a central region and four outer side regions including four outer sides of the first principal surface other than the central region, the central region containing at least one of the first transmission filter, the second transmission filter, or the first reception filter, in the plan view from a thickness direction of the module board, the first inductor and the second inductor are each mounted on a different one of two outer side regions out of the four outer side regions, the two outer side regions being located on opposite sides of the central region. ### Claim 3 (depends on 1) The radio frequency module according to claim 1, further comprising: a columnar electrode applied as a ground electrode, wherein the columnar electrode is mounted on the second principal surface and around the first reception low-noise amplifier, in the plan view from a thickness direction of the module board. ### Claim 4 (depends on 1) The radio frequency module according to claim 1, further comprising: a resin member, a shield electrode layer, and a chip capacitor, wherein the resin member is mounted on the first principal surface to cover the first inductor, the second inductor, and the first principal surface, one input-output electrode of the chip capacitor is connected to the first principal surface while the other input-output electrode of the chip capacitor is connected to the shield electrode layer, the chip capacitor is mounted on between the first inductor and the second inductor, in the plan view from a thickness direction of the module board. ### Claim 5 (depends on 4) The radio frequency module according to claim 4, wherein a main body of the chip capacitor between the two input-output electrodes is covered by a shielding conductive film. ### Claim 6 (depends on 1) The radio frequency module according to claim 1, further comprising: a metal chip connected to a ground, wherein the metal chip is mounted on the first principal surface and between the first inductor and the second inductor, in the plan view from a thickness direction of the module board. ### Claim 7 (depends on 1) The radio frequency module according to claim 1, further comprising: a transmission output matching circuit connected to an output terminal of the first transmission power amplifier; and a reception input matching circuit connected to an input terminal of the first reception low-noise amplifier. ### Claim 8 (depends on 7) The radio frequency module according to claim 7, wherein the transmission output matching circuit includes a first inductance element mounted on the first principal surface, and the reception input matching circuit includes a second inductance element mounted on the first principal surface. ### Claim 9 (depends on 8) The radio frequency module according to claim 8, wherein in a plan view of the module board, a conductive member mounted on the first principal surface is disposed between the first inductance element and the second inductance element. ### Claim 10 (depends on 9) The radio-frequency module according to claim 9, wherein the conductive member includes an electrode that is grounded via the first principal surface. ### Claim 11 A radio frequency module, comprising: a common terminal; a first transmission power amplifier; a second transmission power amplifier; a first transmission filter connected between the common terminal and the first transmission power amplifier, and configured to pass a radio frequency transmission signal of a first band; a second transmission filter connected between the common terminal and the first transmission power amplifier, and configured to pass a radio frequency transmission signal of a second band; a third transmission filter connected between the common terminal and the second transmission power amplifier, and configured to pass a radio frequency transmission signal of a third band; a first switch configured to switch a connection between the first transmission power amplifier and the first transmission filter and a connection between the first transmission power amplifier and the second transmission filter; a first inductor connected between the first switch and the first transmission power amplifier; a second inductor connected between the second transmission power amplifier and the third transmission filter; a first reception low-noise amplifier; a second reception low-noise amplifier; a first reception filter connected between the common terminal and the first reception low-noise amplifier, and configured to pass a radio frequency reception signal of the first band; a second reception filter connected between the common terminal and the second reception low-noise amplifier, and configured to pass a radio frequency reception signal of a fourth band; a second switch configured to switch a connection between the common terminal and the first transmission filter, a connection between the common terminal and the second transmission filter, a connection between the common terminal and the third transmission filter, a connection between the common terminal and the first reception filter, a connection between the common terminal and the second reception filter, and to connect simultaneously the connection between the common terminal and the first transmission filter and the connection between the common terminal and the first reception filter, and the connection between the common terminal and the third transmission filter and the connection between the common terminal and the second reception filter; a third inductor connected between the first reception low-noise amplifier and the first reception filter; a fourth inductor connected between the second reception low-noise amplifier and the second reception filter; a module board including a first principal surface and a second principal surface on opposite side of the first principal surface, wherein the first transmission power amplifier, the second transmission power amplifier, the first transmission filter, the second transmission filter, the third transmission filter, the first reception filter, the second reception filter, the first inductor, the second inductor, the third inductor and the fourth inductor are mounted on the first principal surface, the first switch, the second switch, the first reception low-noise amplifier and the second reception low-noise amplifier are mounted on the second principal surface, the first transmission filter, the second transmission filter, the third transmission filter, the first reception filter, or the second reception filter is mounted between the first inductor and the third inductor in a plan view from a thickness direction of the module board, and the first transmission filter, the second transmission filter, the third transmission filter, the first reception filter, or the second reception filter is mounted between the second inductor and the fourth inductor in a plan view from a thickness direction of the module board. ### Claim 12 (depends on 11) The radio frequency module according to claim 11, wherein in the plan view from a thickness direction of the module board, the first principal surface includes a central region and four outer side regions including four outer sides of the first principal surface other than the central region, the central region containing at least one of the first transmission filter, the second transmission filter, or the first reception filter, in the plan view from a thickness direction of the module board, the first inductor and the second inductor are each mounted on a different one of two outer side regions out of the four outer side regions, the two outer side regions being located on opposite sides of the central region. ### Claim 13 (depends on 11) The radio frequency module according to claim 11, further comprising: a columnar electrode applied as a ground electrode, wherein the columnar electrode is mounted on the second principal surface and around the first reception low-noise amplifier, in the plan view from a thickness direction of the module board. ### Claim 14 (depends on 11) The radio frequency module according to claim 11, further comprising: a resin member, a shield electrode layer, and a chip capacitor, wherein the resin member is mounted on the first principal surface to cover the first inductor, the second inductor, and the first principal surface, one input-output electrode of the chip capacitor is connected to the first principal surface while the other input-output electrode of the chip capacitor is connected to the shield electrode layer, the chip capacitor is mounted on between the first inductor and the second inductor, in the plan view from a thickness direction of the module board. ### Claim 15 (depends on 14) The radio frequency module according to claim 14, wherein a main body of the chip capacitor between the two input-output electrodes is covered by a shielding conductive film. ### Claim 16 (depends on 11) The radio frequency module according to claim 11, further comprising: a metal chip connected to a ground, wherein the metal chip is mounted on the first principal surface and between the first inductor and the second inductor, in the plan view from a thickness direction of the module board. ### Claim 17 (depends on 11) The radio frequency module according to claim 11, further comprising: a first transmission output matching circuit connected to an output terminal of the first transmission power amplifier; a second transmission output matching circuitry connected to an output terminal of the second transmission power amplifier; a first reception input matching circuitry connected to an input terminal of the first reception low-noise amplifier; and a second reception input matching circuit connected to an input terminal of the second reception low-noise amplifier. ### Claim 18 (depends on 17) The radio frequency module according to claim 17, wherein the first and second transmission output matching circuits respectively include first and second inductance elements mounted on the first principal surface, and the first and second reception input matching circuits respectively include second and third inductance elements mounted on the first principal surface. ### Claim 19 (depends on 18) The radio frequency module according to claim 18, wherein in a plan view of the module board, a conductive member mounted on the first principal surface is disposed at least one of between the first inductance element and the third inductance element or between the second inductance element and the fourth inductance element. ### Claim 20 (depends on 19) The radio-frequency module according to claim 19, wherein the conductive member includes an electrode that is grounded via the first principal surface.