# US 12,015,357 B2 · Cooling system for use in power converters > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,015,357 B2 - Document ID: US12015357B2 - Status: Granted - Kind: B2 - Application number: 17/439,769 - Filed: 2020-03-17 - Published: 2022-06-16 - Granted: 2024-06-18 - Earliest claimed: 2019-03-18 - Applicants: Dcbel Inc. - Inventors: Peter Ibrahim; Hani Vahedi; Marc-André Forget - Web page: https://patentgrep.com/patent/US12015357B2 ## CPC - H02M 7/797: using semiconductor devices only - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H02M 7/483: Converters with outputs that each can have more than two voltages levels - H02M 7/4837: {Flying capacitor converters} - H05K 7/14322: {wherein the control and power circuits of a power converter are arranged within the same casing} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H05K 7/20909: {Forced ventilation, e.g. on heat dissipaters coupled to components} - H05K 7/20945: {Thermal management, e.g. inverter temperature control} - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A power conversion apparatus with modified cooling properties has been disclosed. The apparatus comprises an AC port, at least one DC port, a chassis, at least one power conversion module mounted in said chassis connectable to off-board conductors and said AC and said at least one DC ports, a module heat sink attached to each one of said at least one power conversion module for cooling said module, wherein said off-board inductors are mounted in said chassis together and separate from modules with one or more of an inductor heat sink and cooling fluid circulator for cooling said inductors. ## Claims ### Claim 1 A power conversion apparatus comprising: an AC port; at least one DC port; a chassis; at least one power conversion module mounted in said chassis and connected to a controller, said at least one power conversion module comprising a number of semiconductor power switches driven at a switching frequency by said controller, at least one off-board component, a connector for said AC port, at least one temperature sensor connected to said controller and a connector for said at least one DC port; a first cooling system, having a first heat dissipation capacity, for dissipating heat from said number of semiconductor power switches when driven at said switching frequency; a second cooling system, having a second heat dissipation capacity, for dissipating heat from said at least one off-board component when said number of semiconductor power switches are driven at said switching frequency; and wherein said controller is configured to adjust said switching frequency in response to said at least one temperature sensor to correspond to and prevent exceeding said first heat dissipation capacity of the first cooling system and said second heat dissipation capacity of the second cooling system. ### Claim 2 (depends on 1) The power conversion apparatus of claim 1, wherein said at least one power conversion module is a bidirectional power conversion module. ### Claim 3 (depends on 1) The power conversion apparatus in claim 1, wherein said at least one DC port is at least two DC ports. ### Claim 4 (depends on 1) The power conversion apparatus of claim 1, wherein said at least one power conversion module is at least two power conversion modules and the power conversion apparatus provides DC to DC charging. ### Claim 5 (depends on 1) The power conversion apparatus of claim 1, further comprising a compartment separate from said modules comprising at least one inductor and one or more of an inductor heat sink and cooling fluid circulator. ### Claim 6 (depends on 1) The power conversion apparatus of claim 1, wherein said at least one power conversion module is a multi-level rectifier/inverter circuit. ### Claim 7 (depends on 1) The power conversion apparatus of claim 1, wherein said first cooling system comprises at least one fan arranged to blow air over a block heat sink with fins of said heat sink and mounted in a first air duct. ### Claim 8 (depends on 7) The power conversion apparatus of claim 7, wherein said second cooling system comprises at least one fan arranged to blow air over at least said inductors within a second air duct. ### Claim 9 A method for controlling a power conversion apparatus comprising an AC port, at least one DC port, a chassis, and at least one power conversion module mounted in said chassis and connected to a controller, said at least one power conversion module comprising at least one temperature sensor connected to said controller, at least one off-board component, a connector for said AC port, and a number of semiconductor power switches, the method comprising: defining in said controller a switching frequency of said number of semiconductor power switches of said at least one power conversion module; providing a first cooling system having a first heat dissipation capacity for said number of semiconductor power switches based on heat generated from said switches at said selected switching frequency; providing a second cooling system having a second heat dissipation capacity for said at least one off-board component based on heat generated by said at least one off-board component at said selected switching frequency; and adjusting, using said controller, said switching frequency in response to said at least one temperature sensor to correspond to and prevent exceeding said first heat dissipation capacity of the first cooling system and said second heat dissipation capacity of the second cooling system. ### Claim 10 (depends on 9) The method in claim 9, further comprising adjusting said first cooling system based on a first temperature of said switches. ### Claim 11 (depends on 9) The method in claim 9, further comprising adjusting said second heat dissipation capacity based on a second temperature of said at least one off-board component.