# US 12,015,241 B2 · Laser module and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,015,241 B2 - Document ID: US12015241B2 - Status: Granted - Kind: B2 - Application number: 17/381,536 - Filed: 2021-07-21 - Published: 2021-11-11 - Granted: 2024-06-18 - Earliest claimed: 2019-01-25 - Assignees: Vivo Mobile Communication Co., Ltd. - Applicants: Vivo Mobile Communication Co., Ltd. - Inventors: Feng Zhou - Web page: https://patentgrep.com/patent/US12015241B2 ## CPC - H01S 5/02218: Material of the housings; Filling of the housings - H01S 5/02476: {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements} - H01S 5/0225: Out-coupling of light - H01S 5/02345: Wire-bonding - H01S 5/0235: Method for mounting laser chips - H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC} - H01S 5/02208: characterised by the shape of the housings - H01S 5/02253: using lenses - H01S 5/02257: using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract A laser module includes an optical assembly, a laser chip disposed on a side of the optical assembly, a power supply structure, a packaging structure and a heat dissipation structure. The power supply structure includes a first electrode and a second electrode both connected to the laser chip. An accommodating cavity is formed in the packaging structure, and the optical assembly is at least partially received in the accommodating cavity. The heat dissipation structure is sleeved on an outer side of the packaging structure, and abuts against the first electrode and the second electrode. ## Claims ### Claim 1 A laser module, comprising: an optical assembly; a laser chip, disposed on a side of the optical assembly; a power supply structure, comprising a first electrode and a second electrode, wherein the first electrode and the second electrode are both connected to the laser chip; a packaging structure in which an accommodating cavity is formed, wherein the optical assembly is at least partially received in the accommodating cavity; and a heat dissipation structure, sleeved on an outer side of the packaging structure, wherein the heat dissipation structure abuts against the first electrode and the second electrode; the heat dissipation structure comprises a heat dissipation body and a heat conductor, wherein the heat dissipation body is sleeved on the outer side of the packaging structure, one side of the heat conductor abuts against the heat dissipation body, and another side of the heat conductor abuts against the first electrode and the second electrode; and the heat dissipation body comprises a substrate and an extension piece, wherein the substrate is sleeved on the outer side of the packaging structure, the substrate comprises a first end and a second end opposite to and facing away from each other, the first end abuts against the heat conductor, the second end is connected to the extension piece, and the extension piece is located on a side of the optical assembly away from the laser chip. ### Claim 2 (depends on 1) The laser module according to claim 1, wherein the substrate comprises a first side plate, a second side plate, a third side plate, and a fourth side plate that are sequentially connected; a first through hole is surrounded by the first side plate, the second side plate, the third side plate, and the fourth side plate; the packaging structure is located in the first through hole; and the extension piece is disposed on the first side plate and/or the third side plate. ### Claim 3 (depends on 2) The laser module according to claim 2, wherein a first extension piece and a second extension piece are disposed on the first side plate; a third extension piece and a fourth extension piece are disposed on the third side plate; the first extension piece is connected to the third extension piece and the second side plate; the third extension piece is connected to the second side plate; the second extension piece is connected to the fourth extension piece and the fourth side plate; and the fourth extension piece is connected to the fourth side plate. ### Claim 4 (depends on 2) The laser module according to claim 2, wherein a second through hole is formed in the heat conductor; the first electrode and the second electrode are located in the second through hole; and the first electrode and the second electrode both abut against an inner wall of the heat conductor. ### Claim 5 (depends on 1) The laser module according to claim 1, wherein the optical assembly comprises an optical element and a collimating element; the collimating element is disposed on a side of the laser chip, and the collimating element is received in the accommodating cavity; the optical element is disposed on a side of the collimating element away from the laser chip; and the extension piece abuts against a side of the optical element away from the collimating element. ### Claim 6 (depends on 5) The laser module according to claim 5, wherein a light divergence element is disposed on a side of the optical element facing the collimating element. ### Claim 7 (depends on 1) The laser module according to claim 1, wherein the heat conductor is made of an electrically non-conductive material, and the heat dissipation body is made of a metal material. ### Claim 8 An electronic device, comprising a laser module, wherein the laser module comprises: an optical assembly; a laser chip, disposed on a side of the optical assembly; a power supply structure, comprising a first electrode and a second electrode, wherein the first electrode and the second electrode are both connected to the laser chip; a packaging structure in which an accommodating cavity is formed, wherein the optical assembly is at least partially received in the accommodating cavity; and a heat dissipation structure, sleeved on an outer side of the packaging structure, wherein the heat dissipation structure abuts against the first electrode and the second electrode; the heat dissipation structure comprises a heat dissipation body and a heat conductor, wherein the heat dissipation body is sleeved on the outer side of the packaging structure, one side of the heat conductor abuts against the heat dissipation body, and another side of the heat conductor abuts against the first electrode and the second electrode; and the heat dissipation body comprises a substrate and an extension piece, wherein the substrate is sleeved on the outer side of the packaging structure, the substrate comprises a first end and a second end opposite to and facing away from each other, the first end abuts against the heat conductor, the second end is connected to the extension piece, and the extension piece is located on a side of the optical assembly away from the laser chip. ### Claim 9 (depends on 8) The electronic device according to claim 8, wherein the substrate comprises a first side plate, a second side plate, a third side plate, and a fourth side plate that are sequentially connected; a first through hole is surrounded by the first side plate, the second side plate, the third side plate, and the fourth side plate; the packaging structure is located in the first through hole; and the extension piece is disposed on the first side plate and/or the third side plate. ### Claim 10 (depends on 9) The electronic device according to claim 9, wherein a first extension piece and a second extension piece are disposed on the first side plate; a third extension piece and a fourth extension piece are disposed on the third side plate; the first extension piece is connected to the third extension piece and the second side plate; the third extension piece is connected to the second side plate; the second extension piece is connected to the fourth extension piece and the fourth side plate; and the fourth extension piece is connected to the fourth side plate. ### Claim 11 (depends on 9) The electronic device according to claim 9, wherein a second through hole is formed in the heat conductor; the first electrode and the second electrode are located in the second through hole; and the first electrode and the second electrode both abut against an inner wall of the heat conductor. ### Claim 12 (depends on 8) The electronic device according to claim 8, wherein the optical assembly comprises an optical element and a collimating element; the collimating element is disposed on a side of the laser chip, and the collimating element is received in the accommodating cavity; the optical element is disposed on a side of the collimating element away from the laser chip; and the extension piece abuts against a side of the optical element away from the collimating element. ### Claim 13 (depends on 12) The electronic device according to claim 12, wherein a light divergence element is disposed on a side of the optical element facing the collimating element. ### Claim 14 (depends on 8) The electronic device according to claim 8, wherein the heat conductor is made of an electrically non-conductive material, and the heat dissipation body is made of a metal material.